A method of manufacturing an electronic component includes: preparing an element body configured to have a rectangular parallelepiped shape and include a first surface serving as a mounting surface, a second surface opposing the first surface, and a third surface extending in such a way as to connect the first surface and the second surface; forming a chamfered portion chamfered between the first surface and the third surface; forming a terminal electrode on the first surface; covering the chamfered portion and the first surface with a covering member; forming a metal shield film on a part of the element body, the part including at least the second surface and the third surface and exposed from the covering member; and removing the covering member.

Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.

A filter structure includes a capacitive device and an inductive device. The capacitive device includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, and a dielectric layer between the ground plane and the plate. The inductive device includes first and second conductive paths in a third metal layer of the IC package, each of the first and second conductive paths is electrically connected to the plate and has a width w, the first and second conductive paths are separated by a spacing s, and a ratio s/w has a value ranging from 1 to 2.

An electronic component includes a first terminal, a second terminal, a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode. The third capacitor electrode is connected to the first terminal. The first capacitor electrode defines a first capacitor along with the third capacitor electrode. The second capacitor electrode defines a second capacitor along with the third capacitor electrode. The second capacitor electrode is connected to the second terminal. A plurality of dielectric layers include a connection layer where a first portion of the first terminal and a second portion of the second terminal are disposed. An inductance of a path from the second capacitor electrode to the second portion is lower than an inductance of a path from the third capacitor electrode to the first portion.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

A communication system where a central node (base-station or access point) communicates with multiple clients in its neighbourhood using transparent immediate beam-forming. Resource allocation and channel access is such that the central node does not necessarily know when each client starts its transmission. Receive beam-forming in such a system is not possible, as beam-forming coefficients for each client should be selected according to the particular channel realization from that client to the central node. Each client is detected early in its transmission cycle, based on either a signature that is part of the physical characteristics unique to that client, or based on a signature that is intentionally inserted in the clients' signal, and accordingly adjusts its beam-forming coefficients.

A filter structure includes a ground plane in a first metal layer of an IC package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device. An inductive device in a third metal layer of the IC package is electrically connected to the plate, and a perimeter of the plate is aligned with a perimeter of the inductive device.

A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.

An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.

An element body includes a first function portion including a first material, a second function portion including a second material different from the first material, and an intermediate portion placed between the first function portion and the second function portion. The intermediate portion includes a first component included in the first material, and a second component included in the second material. A side surface of the element body includes surfaces of the first function portion, the second function portion, and the intermediate portion. Each of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion. An insulating layer is formed on the side surface in such a manner as to be in contact with at least a region exposed from the electrode portions between the electrode portions in the surface of the intermediate portion.