A self-contained radio-frequency device featuring multiple overlapping coupled coil inductors in a planar configuration with overlaps selected for desired coupling between different pairs of coils, wherein the electromagnetic energy of the coils arises substantially only from the coils themselves and affects only the coils themselves. Overlapping configurations provide a compact space-saving form-factor for such a device a variety of applications, including filters, baluns, transformers, matching networks, amplifier stages, distributed amplifiers, and frequency multipliers. Space-saving is achieved by overlapping the coils while controlling the mutual inductance. The planar arrangements are applicable to a variety of technologies, such as integrated circuits (IC, ASIC, RFIC), ceramic multilayer technologies such as low temperature co-fired ceramics (LTCC), and to printed circuit boards (PCB). Planar arrangements of overlapping coils is illustrated with respect to filters, tunable filters and Q-enhanced filters.

An LC filter having a multilayer body, coil conductor patterns, a thin-film capacitor, and input/output terminal conductors. The multilayer body is formed by stacking a plurality of resin sheets. At least a portion of the coil conductor pattern is embedded in a resin sheet. The thin-film capacitor is at least partially embedded in the resin sheet, is disposed in the coil opening of the coil conductor pattern, which is spiral-shaped, and is connected to the coil conductor pattern. The thickness of the coil conductor patterns is smaller than the thickness of the resin sheets, and the thickness of the thin-film capacitor is smaller than the thickness of the resin sheets.

An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.

An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.

A filter structure includes a ground plane in a first metal layer of an IC package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device. An inductive device in a third metal layer of the IC package is electrically connected to the plate, and a perimeter of the plate is aligned with a perimeter of the inductive device.

An electronic component includes a first terminal, a second terminal, a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode. The third capacitor electrode is connected to the first terminal. The first capacitor electrode defines a first capacitor along with the third capacitor electrode. The second capacitor electrode defines a second capacitor along with the third capacitor electrode. The second capacitor electrode is connected to the second terminal. A plurality of dielectric layers include a connection layer where a first portion of the first terminal and a second portion of the second terminal are disposed. An inductance of a path from the second capacitor electrode to the second portion is lower than an inductance of a path from the third capacitor electrode to the first portion.

Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.

A resonant circuit includes a first inductor and a first capacitor which define a first series circuit and a second inductor connected in parallel to the first series circuit. The first inductor and the second inductor are coupled via a magnetic field in a direction in which magnetic fluxes passing through the inductor and the second inductor strengthen each other to effectively increase steepness in a transient band.

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.

A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.