A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

The electronic component includes a substantially rectangular parallelepiped multilayer body formed by laminating a plurality of insulation layers, a capacitor including a plurality of capacitor conductor layers provided on the insulation layers, and a substantially spiral-shaped inductor including one or more inductor conductor layers provided on the insulation layers and having a center axis extending along the lamination direction. A mounting surface of the multilayer body is a surface of the multilayer body located on the end of one side of a first orthogonal direction orthogonal to the lamination direction. The inductor conductor layer and the capacitor conductor layer are provided on the first insulation layer. On the first insulation layer, an end portion of the capacitor conductor layer on the one side of the first orthogonal direction are closer to the mounting surface than an end portion of the inductor conductor layer on the one side of the first orthogonal direction.

An oscillation module includes an SAW filter, and a high-pass filter formed in an integrated circuit, the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and the capacitance part includes a capacitance array.

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

An electronic component includes two or more first parallel resonators arranged in an orthogonal direction orthogonal or substantially orthogonal to a lamination direction, each first LC parallel resonator including a first inductor and a first capacitor, two second LC parallel resonators surrounding the two or more first LC parallel resonators from both sides in the orthogonal direction, each second LC parallel resonator including a second inductor and a second capacitor, a second capacitor connected to one end of the two second LC parallel resonators, and a first connecting conductor that connects two of the first LC parallel resonators that are not adjacent in the orthogonal direction, or connects one of the first LC parallel resonators and one of the second LC parallel resonators that are not adjacent in the orthogonal direction.

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.

The present invention relates to a composite electronic component having a dielectric body portion inside of which a conductive body is provided, and a magnetic body portion inside of which a conductive body is provided. In the present invention, a layer made of a metal material is arranged between the dielectric body portion and the magnetic body portion as an intermediate layer.

A circuit element includes a multilayer body, internal elements inside the multilayer body, and first outer electrodes and second outer electrodes on outer surfaces of the multilayer body, and the multilayer body includes laminated base material layers. The internal elements include coil conductors connected to the second outer electrodes, the coil conductors have a winding axis in the laminating direction of the base material layers, the first outer electrodes are in contact with a mounting surface of the multilayer body, the second outer electrodes are in contact with side edges of the multilayer body and separated from the mounting surface, and maximum widths of the second outer electrodes are smaller than maximum widths of the first outer electrodes.

Embodiments disclosed herein include electronic packages and their components. In an embodiment, an electronic package comprises a package substrate and a base die over the package substrate. In an embodiment, the electronic package further comprises a plurality of chiplets over the base die. In an embodiment, the base die comprises a substrate, a first metal layer and a second metal layer between the substrate and the plurality of chiplets, and a third metal layer and a fourth metal layer between the package substrate and the substrate. In an embodiment, a filter is integrated into one or more layers of the base die.