A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.

A common mode choke coil includes a core, and first and second coils opposed to each other and wound on the core. The core can have a square shape, or an elongated shape having a long axis and a short axis when viewed in a direction along a central axis of the core. Each of the first and second coils is a single-layer coil. An area of a cross-section of the core taken perpendicular to a circumferential direction of the core is constant in the circumferential direction of the core. The cross-section of the core has a quadrilateral shape.

A power converter is embodied on a semiconductor substrate member and has a first region with a passive electrical component with a first electrically conductive layer pattern of an electrically conductive material and a second electrically conductive layer pattern of an electrically conductive material deposited on respective sides of the semiconductor substrate member. A trench or through-hole is formed (by etching) in the substrate within the first region, and the electrically conductive material is deposited at least on a bottom portion of the trench or on a sidewall of the through-hole and electrically connected to one or both of the first conductive layer pattern and the second conductive layer pattern. A second region has an active semiconductor component integrated with the semiconductor substrate by being fabricated by a semiconductor fabrication process. There is also provided a power supply, such as a DC-DC converter, embedded the semiconductor substrate member.

A thermal management includes an inductor, a housing in thermal communication with the inductor, the housing defining a wall, and a conductor. The conductor has greater thermal conductivity than the wall and is positioned within a groove and/or an aperture formed in the wall. The conductor is configured to conduct heat through the wall more efficiently than if the conductor were not present. A method of manufacturing a thermal management system includes forming a housing by additive manufacturing. The housing defines a wall having at least one of a groove and an aperture defined therein. The method includes positioning a conductor in at least one of the groove and the aperture. The conductor has a greater thermal conductivity than the wall. The method includes positioning an inductor into thermal communication with the housing.

An inductor damper circuit includes a toroidal inductor having an inductor coil and an inductor housing, and a resistive element configured around a periphery of the inductor coil and having one end connected to the toroidal inductor, where the resistive element is printed on a flexible substrate and configured between the inductor coil and the inductor housing, and the resistive element is integrated with the toroidal inductor.

In order to provide an air core coil fitting apparatus that can automatically fit an air core coil onto a core, an air core coil fitting apparatus includes a holding member, a coil fitting rod, a rod driving member, a pushing member, and a sending member. The holding member holds a core main body that is formed in a ring shape, has a gap extending through the core main body from an inner circumferential face to an outer circumferential face thereof, and allows an air core coil wound in advance to be fitted onto the core main body from one end thereof. On the coil fitting rod, the air core coil that is to be fitted onto the core main body held by the holding member is fitted. The rod driving member brings a front end of the coil fitting rod close to or into contact with the one end of the core main body held by the holding member. The pushing member pushes the air core coil fitted on the coil fitting rod, toward the one end of the core main body. The sending member is disposed at a circumferential edge of the core main body held by the holding member, and pulls the air core coil pushed by the pushing member and fitted onto the core main body, toward another end of the core main body.

An integrated magnetic component comprises a common mode inductance and a differential mode inductance. The common mode inductance is formed by a common mode core surrounding a winding window and at least two windings wound around the common mode core and through the winding window. The differential mode inductance is formed by the at least two windings and a differential mode core being spaced from the common mode core by a gap. The differential mode core comprises at least one surface being adjacent to each of the at least two windings. Further, a filter for attenuating electromagnetic interference comprises an integrated magnetic component according to the invention. Even further, the integrated magnetic component according to the invention is used for attenuating electromagnetic interference, preferably in a vehicle, a data center, or a telecommunication unit. A method for manufacturing an integrated magnetic component according to the invention comprises two steps. One step comprises providing a common mode inductance formed by a common mode core surrounding a winding window, and at least two windings wound around the core and through the winding window. Another step comprises providing a differential mode core and spacing it from the common mode core by a gap, such that at least one surface of the differential mode core is adjacent to each of the least two windings.

Mounting kit for a throttle with a toroidal core, wherein an insulating element which passes through the opening in the toroidal core is provided. The mounting kit includes a first half shell and a second half shell for accommodating the toroidal core, a baseplate, and a latching means and/or guide means to connect the first half shell, the second half shell, the insulating element and the baseplate to one another.

Provided is a power converter in which a magnetic core of a noise filter can be prevented from magnetic saturation and the noise filter can be downsized. A noise filter 140 provided in a power converter includes: a magnetic core 1 formed with a single through-hole 1A and forming a closed magnetic circuit; first wiring 11 having one end 81 connected to a power conversion circuit and the other end drawn out from the second opening 3, and running through the through-hole 1A from one first opening 2 to the other second opening 3; second wiring 21 having one end connected to the other end of the first wiring 11 and the other end 82 drawn out from the first opening 2 as a filter output end, and running through the through-hole 1A from the second opening 3 to the first opening 2; a first capacitor 41 provided between the ground and a connecting portion 31 of the first wiring 11 and the second wiring 21; and the second capacitor 51 provided between the other end 82 of the second wiring 21 and the ground.

A coil electrode included in an inductor component includes a plurality of metal pins upper end surfaces of which are exposed to the upper surface of a resin layer and lower end surfaces of which are exposed to a lower surface of the resin layer, and a plurality of wiring patterns that connect the upper end surfaces or the lower end surfaces of the predetermined metal pins, wherein surface roughnesses of the upper surface and the lower surface of the resin layer are larger than surface roughnesses of the upper end surfaces and the lower end surfaces of the respective metal pins, and wiring patterns are respectively formed on the upper and lower surfaces of the resin layer by plating.