A filter component includes a housing body. A first and at least one second busbar each have a first end section, and a second end section, between which in each case a center section is arranged. The end sections of the busbars each have connections for connecting electrical conductors to the filter component. The first and second end section and the center section of the first busbar are arranged in a first plane and the first and second end section and the center section of the at least one second busbar are arranged in a second plane, which is different from the first plane.

The present disclosure relates to an assembly comprising a housing and at least one busbar for connecting a printed circuit board disposed in the housing to a power supply present outside the housing, wherein the housing has a penetration, from which the busbar projects, wherein a magnetic core and a gasket accommodating the magnetic core are placed in the housing penetration in a media-tight manner, and the gasket, together with the magnetic core, encompasses the busbar in a form-fitting manner.

A circuit board with a measure against high frequency noise includes: an interconnect substrate having an interconnect pattern to which an IC which is a source of high frequency noise is electrically connected; a pair of lands provided on a mounting surface of the interconnect substrate; and a chip component having a body composed of a magnetic body (i.e., ferrite) in a rectangular parallelepiped, and a pair of external electrodes provided at opposite ends of the body, the pair of external electrodes being connected to the pair of lands, the body being disposed on the interconnect pattern, as observed in a direction perpendicular to the mounting surface.

A noise current absorber including a pair of housing parts capable of housing each of the pair of magnetic bodies, wherein the pair of magnetic bodies forms an overall cylindrical shape or a ring shape when abutted against each other; an engaging portion and an engaged portion capable of maintaining a closed state of the pair of housing parts; and a wall molded integrally with at least a first housing part of the pair of housing parts, adjacent to an abutting surface of at least the first housing part against a second housing part of the pair of housing parts, the wall protruding to a side where the second housing part abuts.

A wire harness includes electric wires, and an electromagnetic wave suppression member that includes a restricting member and an annular magnetic core, the restricting member being provided to cover a periphery of the electric wires and including an inner wall portion more rigid than the electric wires, and the magnetic core being provided around the inner wall portion. The restricting member includes fixing portions formed to fix the electromagnetic wave suppression member to a fixing target.

In large area plasma processing systems, process gases may be introduced to the chamber via the showerhead assembly which may be driven as an RF electrode. The gas feed tube, which is grounded, is electrically isolated from the showerhead. The gas feed tube may provide not only process gases, but also cleaning gases from a remote plasma source to the process chamber. The inside of the gas feed tube may remain at either a low RF field or a zero RF field to avoid premature gas breakdown within the gas feed tube that may lead to parasitic plasma formation between the gas source and the showerhead. By feeding the gas through an RF choke, the RF field and the processing gas may be introduced to the processing chamber through a common location and thus simplify the chamber design.

A noise current absorber includes a pair of split magnetic bodies formed by equally splitting an annular magnetic body into an open annular shape, and a pair of housing parts capable of housing the split magnetic bodies. The pair of housing parts are coupled, and thus the pair of split magnetic bodies are abutted into an annular shape. The pair of housing parts include a first spring and a pair of second springs. The first spring is disposed in a central region of a bottom surface of the housing part facing the split magnetic body. The pair of second springs are disposed on both sides of the first spring.

This application relates to an active current compensation device which actively compensates for a noise occurring in a common mode in each of two or more high-current paths. In one aspect, the active current compensation device includes a sensing unit configured to generate an output signal corresponding to a common-mode noise current on each of the two or more high-current paths, and an amplification unit configured to amplify the output signal to generate an amplified current. The device may also include a compensation unit configured to generate a compensation current on the basis of the amplified current and allow the compensation current to flow to each of the two or more high-current paths, and a malfunction detection unit configured to detect a malfunction of the amplification unit. The malfunction detection unit and at least a portion of the amplification unit may be embedded in one integrated circuit (IC) chip.

An inductor includes a first magnetic body having a toroidal shape and having a ferrite; and a second magnetic body configured to be different from the first magnetic body and including a metal ribbon, wherein the second magnetic body includes an outer magnetic body disposed on an outer circumferential surface of the first magnetic body and an inner magnetic body disposed on an inner circumferential surface of the first magnetic body, and each of the outer magnetic body and inner magnetic body is wound in a plurality of layers in a circumferential direction of the first magnetic body.

The structure includes a semiconductor chip connected to a substrate via one or more solder balls. The semiconductor chip includes one or more on-chip metal winding. The structure includes a first ferromagnetic core. The first ferromagnetic core is located below the semiconductor chip and above the substrate. The structure includes a second ferromagnetic core. The second ferromagnetic core is located above the semiconductor chip. The first ferromagnetic core and the second ferromagnetic core create a magnetic loop.