In an embodiment, a filter element includes at least one magnetic core accommodated in a housing and at least one fastening element arranged on the housing, wherein the fastening element is configured to connect the filter element directly to a current-conducting element, and wherein the filter element is configured to filter an interference signal.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

An inductor includes a first magnetic body having a toroidal shape and having a ferrite; and a second magnetic body configured to be different from the first magnetic body and including a metal ribbon, wherein the second magnetic body includes an outer magnetic body disposed on an outer circumferential surface of the first magnetic body and an inner magnetic body disposed on an inner circumferential surface of the first magnetic body, and each of the outer magnetic body and inner magnetic body is wound in a plurality of layers in a circumferential direction of the first magnetic body.

A noise filter may include: a first conductive line extending between an input and an output terminal portion, wherein the first conductive line includes an input-side conductive line extending between the input terminal portion and a branch portion, and an output-side conductive line extending between the output terminal portion and the branch portion; a second conductive line connected to the branch portion of the first conductive line, wherein a capacitor is on the second conductive line; and a magnetic body surrounding at least a part of a circumference of at least a part of the first conductive line, wherein the magnetic body is configured to magnetically couple the input-side and the output-side conductive lines such that at least an equivalent series inductance of the capacitor and a parasitic inductance of the second conductive line are reduced by a mutual inductance between the input-side conductive line and the output-side conductive line.

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.

An electronic substrate may be fabricated by forming a base substrate and forming an inductor extending through the base substrate, wherein the inductor includes a magnetic material layer and a barrier layer, such that the barrier layer prevents the magnetic material layer from leaching into plating solutions during the fabrication of the electronic substrate. In one embodiment, the barrier material may comprise titanium. In another embodiment, the barrier layer may comprise a polymeric material. In still another embodiment, the barrier layer may comprise a nitride material layer. The inductor may further include a plating seed layer on the barrier layer and a conductive fill material abutting the plating seed layer.

Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.

Disclosed are designs for inductor cores for electromagnetic interference (EMI) filters. In some embodiments, an inductor core comprises a plurality of enclosed structures, where each enclosed structure of the plurality of enclosed structures includes a plurality of elongated bars and at least one connection device. In some embodiments, an enclosed structure is configured to encompass a signal bus. In some embodiments, an enclosed structure has a longitudinal axis and a triangular cross-sectional shape taken perpendicular to the longitudinal axis.

A noise reduction element includes a protruded portion on which a bent portion of a conductive wire is hooked, and a winder portion around which both a first conductive wire portion extending in one direction from the bent portion of the conductive wire hooked on the protruded portion and a second conductive wire portion extending in another direction from the bent portion of the conductive wire hooked on the protruded portion are wound in a state where the first and second conductive wire portions are parallel to each other.

A transformer configured for use in connection with a variable speed motor drive includes primary windings and secondary windings. The secondary windings are configured as wye-windings and a ground lead and a plurality of phase leads. The transformer includes a ferrite blocking circuit connected to the ground lead.