A vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The vapor chamber with circuit unit makes an effective improvement to the space efficiency of the electronic device.

A vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The vapor chamber with circuit unit makes an effective improvement to the space efficiency of the electronic device.

An apparatus for a wireless power transfer (WPT) pad heat management system includes a ferrite structure positioned adjacent to a coil configured to wirelessly transfer power. The apparatus includes a plurality of heat spreaders positioned along a length of a component of the ferrite structure. Each of the plurality of heat spreaders is non-metallic. The apparatus includes a trough shaped to surround at least a portion of each of the plurality of heat spreaders, wherein the trough is non-metallic. The apparatus includes a phase change material (PCM) in the trough where at least a portion of the heat spreaders extend into the PCM. The ferrite structure, coil, plurality of heat spreaders, trough and PCM are encased in a solid material, and each of the plurality of heat spreaders comprises a material that transfers heat from the component of the ferrite structure to the PCM.

An apparatus for a wireless power transfer (WPT) pad heat management system includes a ferrite structure positioned adjacent to a coil configured to wirelessly transfer power. The apparatus includes a plurality of heat spreaders positioned along a length of a component of the ferrite structure. Each of the plurality of heat spreaders is non-metallic. The apparatus includes a trough shaped to surround at least a portion of each of the plurality of heat spreaders, wherein the trough is non-metallic. The apparatus includes a phase change material (PCM) in the trough where at least a portion of the heat spreaders extend into the PCM. The ferrite structure, coil, plurality of heat spreaders, trough and PCM are encased in a solid material, and each of the plurality of heat spreaders comprises a material that transfers heat from the component of the ferrite structure to the PCM.

A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

The present invention relates to gas-insulated electrical apparatuses, in particular gas-insulated transformers or reactors, comprising a housing enclosing an interior space, in which an electrical component comprising a winding is arranged, at least a portion of the interior space defining an insulation space which is filled with an insulation fluid electrically insulating at least a part of the electrical component from the housing. According to the invention, the electrical apparatus further comprises a cooling element comprising a condenser, an evaporator and a cooling fluid to be circulated between the condenser and the evaporator. The evaporator is designed such that at least a part of the electric component is immersed in the cooling fluid in its liquid state, thus being in direct contact with the cooling fluid.

The present invention relates to gas-insulated electrical apparatuses, in particular gas-insulated transformers or reactors, comprising a housing enclosing an interior space, in which an electrical component comprising a winding is arranged, at least a portion of the interior space defining an insulation space which is filled with an insulation fluid electrically insulating at least a part of the electrical component from the housing. According to the invention, the electrical apparatus further comprises a cooling element comprising a condenser, an evaporator and a cooling fluid to be circulated between the condenser and the evaporator. The evaporator is designed such that at least a part of the electric component is immersed in the cooling fluid in its liquid state, thus being in direct contact with the cooling fluid.

A vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The vapor chamber with circuit unit makes an effective improvement to the space efficiency of the electronic device.

A vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The vapor chamber with circuit unit makes an effective improvement to the space efficiency of the electronic device.