An inductor includes a printed wiring board (PWB) and a plurality of electrically-conductive heat pipes operatively connected to the PWB. The PWB includes electrically conductive traces electrically connected to the plurality of electrically-conductive heat pipes. The traces and plurality of electrically conductive heat pipes form an inductor winding. A method of manufacturing an inductor includes mounting a plurality of electrically conductive heat pipes to a printed wiring board (PWB), wherein the PWB includes electrically conductive traces to connect the plurality of electrically-conductive heat pipes to form an inductor winding.

A magnetic element is disclosed, and includes a magnetic core, at least one winding set and at least one heat conduction pipe. The magnetic core includes two magnetic columns arranged oppositely, and two magnetic plates arranged oppositely. The magnetic plates respectively cover two opposite end surfaces of each magnetic column to mutually form a closed magnetic flux path with the magnetic columns. Each of the magnetic columns includes a plurality of first magnetic blocks stacked together. Each of the magnetic plates includes at least one second magnetic block. The winding set binds one of the magnetic columns. The heat conduction pipe is disposed internally in one of the magnetic columns.

A magnetic element is disclosed, and includes a magnetic core, at least one winding set and at least one heat conduction pipe. The magnetic core includes two magnetic columns arranged oppositely, and two magnetic plates arranged oppositely. The magnetic plates respectively cover two opposite end surfaces of each magnetic column to mutually form a closed magnetic flux path with the magnetic columns. Each of the magnetic columns includes a plurality of first magnetic blocks stacked together. Each of the magnetic plates includes at least one second magnetic block. The winding set binds one of the magnetic columns. The heat conduction pipe is disposed internally in one of the magnetic columns.

In one embodiment, the invention may be an impedance matching network including an input configured to operably couple to a radio frequency source, an output configured to operably couple to a load, and a first variable capacitor. The matching network may further include an inductor formed from a heat pipe that is wound in a three-dimensional shape. A first heat sink may be coupled adjacent to a first end of the heat pipe, and a second heat sink may be coupled adjacent to a second, opposite end of the heat pipe.

In one embodiment, the invention may be an impedance matching network including an input configured to operably couple to a radio frequency source, an output configured to operably couple to a load, and a first variable capacitor. The matching network may further include an inductor formed from a heat pipe that is wound in a three-dimensional shape. A first heat sink may be coupled adjacent to a first end of the heat pipe, and a second heat sink may be coupled adjacent to a second, opposite end of the heat pipe.

An inductor at a wireless power antenna includes a conductive winding. A portion of the conductive winding consists of a heat pipe. The heat pipe employs thermal conductivity and phase transition to transfer heat from the inductor. A heat sink is coupled to the heat pipe.

A cooling system for cooling an electronic component has a heat pipe defined by an inner wall and an outer wall with an intermediate fluid chamber. The heat pipe has a wall to be put in contact with a cold plate and extends away from the cold plate to define a cup shape with a fluid movement member positioned within the chamber to move the fluid from an end of the chamber adjacent to the cold plate to a spaced end of the cup shape.

A cooling system for cooling an electronic component has a heat pipe defined by an inner wall and an outer wall with an intermediate fluid chamber. The heat pipe has a wall to be put in contact with a cold plate and extends away from the cold plate to define a cup shape with a fluid movement member positioned within the chamber to move the fluid from an end of the chamber adjacent to the cold plate to a spaced end of the cup shape.

A hydrofluoroether compound represented by the following general formula (I).

##STR00001##

A hydrofluoroether compound represented by the following general formula (I).

##STR00001##