H01F2027/2809

Laminate Transformer with Overlapping Lead Frame
20230005652 · 2023-01-05 ·

An apparatus has a laminate substrate that has a first surface and an opposite second surface. A laminate transformer is located within the laminate substrate between the first surface and the second surface. The transformer has a first coil adjacent the first surface and a second coil adjacent the second surface. A magnetic core element on the first surface overlaps a portion of the first coil. A lead frame on the first surface is spaced apart from the magnetic core element. A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path.

SYSTEMS AND METHODS FOR IMPROVING WINDING LOSSES IN PLANAR TRANSFORMERS

Systems and methods for improving winding losses in transformers. In one aspect, a transformer includes a first magnetic core having a first portion in contact with a second magnetic core and a second portion separated from the second magnetic core by a distance d, a plurality of primary windings formed around the second portion, a first secondary winding forming a first layer having a first inner diameter, a second secondary winding forming an n.sup.th layer having a second inner diameter. The plurality of primary windings are positioned between the first layer and the n.sup.th layer, where the plurality of primary windings, and the first secondary winding and the second secondary winding are formed around the second portion, and a difference between the first inner diameter and the second inner diameter defines a distance y, and a ratio of distance y to distance d is between 0.01 to 10.

HIGH FREQUENCY INTEGRATED PLANAR MAGNETICS FOR A BIDIRECTIONAL AC TO DC CLLC RESONANT CONVERTER
20230005653 · 2023-01-05 ·

A transformer for a power converter, comprising: a first auxiliary subcore, a central subcore, and a second auxiliary subcore, each respective subcore comprising a lower plate, at least one pair of central spacers, and an upper plate, the lower plate, at least one pair of central spacers, and the upper plate of each subcore, being respectively separated by a gap; the first auxiliary subcore and the central subcore being separated by a gap; the second auxiliary subcore and the central subcore being separated by a gap; a primary coil, encircling a first spacer of the first auxiliary subcore and a first spacer of the central subcore; and a secondary coil, encircling a second spacer of the second auxiliary subcore and a second spacer of the central subcore.

Electronic component and electronic component module

An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.

Transformer, electromagnetic device and manufacturing method of the transformer

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

Multi-die module with contactless coupler and a coupling loss reduction structure

A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

Functionally graded thermal vias for inductor winding heat flow control

Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

Integrating Trans-Inductor Voltage Regulator (TLVR) in Vertical Power Delivery
20220415558 · 2022-12-29 ·

The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.

ELECTRONIC COMPONENT

An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

COIL COMPONENT
20220415560 · 2022-12-29 · ·

A coil component includes: a body; a coil unit including lead-out ends and coils, and embedded in the body; and a core penetrating through the coil unit in a first direction, wherein a cross-section of each of the coils perpendicular to a direction in which the coil is wound has a plurality of round portions disposed on a side facing the core.