A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

An integrated magnetic core is provided. The integrated magnetic core includes a first plate and a second plate. The first plate includes a plurality of legs extending outwardly from a first surface of the first plate. The plurality of legs includes first and second oppositely disposed legs and third and fourth oppositely disposed legs. The second plate is coupled to at least the third and fourth legs of the first plate.

A high-voltage isolation withstand planar transformer and its high-voltage insulation method are provided. An insulating medium is provided between low-voltage windings and high-voltage windings. High-frequency current flows through the windings and generates a high-frequency alternating magnetic field to achieve isolated energy transmission. The low-voltage windings are connected to low-voltage side connection terminals, and the high-voltage windings are connected to high-voltage side connection terminals through a high-voltage winding leading-out foil. An annular hollow part of the low-voltage windings and the high-voltage windings is provided with a magnetic core. A stress grading method is provided to control the distribution of the electric field around the high-voltage winding leading-out foil. A voltage-balancing element group provides a voltage potential with a gradient change between the high-voltage winding leading-out foil and the low-voltage windings. The new transformer has small size, high power density and low cost.

An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate.

The present invention relates to a planar converter, comprising: a magnetic unit comprising a first planar winding and two second planar windings magnetically coupled to each other and a magnetic core assembly; two closed circuits each comprises the first planar winding, a switch, and has a first connection point and a second connection point; two PCBs each provided with at least one of the closed circuits thereon; and two first connectors each comprising two welding ends opposite to each other, wherein the two welding ends of one of the two first connectors are connected to the first connection points of the two closed circuits, respectively, and the two welding ends of another one of the two first connectors are connected to the second connection points of the two closed circuits, respectively, and the two closed circuits are connected in parallel.

Provided is an electrical arrangement with a printed circuit board built up in parallel layers, comprising a shield, a transformer for transmitting signals from a primary side to a secondary side, the transformer having a first coil winding and a second coil winding and a third coil winding, the first coil winding forming the primary side of the transformer and the second and third coil windings forming the secondary side of the transformer, and a magnetic conductor, wherein the circuit board has openings which are penetrated by parts of the magnetic conductor, and the magnetic conductor and the shield and the transformer are magnetically coupled, and wherein the shield is a potential-free shield.

A converter using a planar transformer includes an input device that receives a first voltage, a transformer including a first planar transformer and a second planar transformer that reduce the first voltage, and an output device that outputs the first voltage as a second voltage, wherein the first voltage is greater than the second voltage, and the input device provides a current to a primary winding coil of each of the first planar transformer and the second planar transformer through a first current path and a second current path in which current directions are different with each other, and includes a plurality of inductors connected in parallel with the primary winding coil of each of the first planar transformer and the second planar transformer.

Present disclosure provides a winding assembly and a magnetic element. The winding assembly comprises a substrate with a central hole and a first winding disposed in the substrate, the first winding comprising two layers of coil wound around a central hole in the substrate; wherein, a second end of a first layer of coil away from the central hole is connected to a first end of a second layer of coil away from the central hole, and a first end of the first layer of coil close to the central hole and a second end of the second layer of coil close to the central hole serve as a starting-end and a finishing-end of the first winding, respectively. The magnetic element comprises a winding assembly and a magnetic core, and the winding assembly is sleeved on a magnetic leg of the magnetic core.

A stacked inductor device including an 8-shaped inductor structure a stacked coil. The 8-shaped inductor structure includes a first coil and a second coil. The first coil is disposed in a first area. The first coil includes a first sub-coil and a second sub-coil, and the first sub-coil and the second sub-coil are disposed with an interval circularly with each other. The second coil is disposed in a second area, and the second coil is coupled with the first coil on a boundary between the first area and the second area. The second coil includes a third sub-coil and a fourth sub-coil, and the third sub-coil and the fourth sub-coil are disposed with an interval circularly with each other. The stacked coil is coupled to the first coil and the second coil and is stacked partially on or under the first coil and the second coil.

Present disclosure provides a winding assembly and a magnetic element. The winding assembly includes a circuit board with a central hole and a first winding wound around the central hole in the circuit board; the first winding includes N turns of coil on at least two wiring layers; a second end of at least one turn of coil on a first wiring layers is connected to a first end of next turn of coil at corresponding position on a second wiring layer of the circuit board. The magnetic element includes a magnetic core and a winding assembly sleeved on a magnetic leg.