H01F2027/2819

Voltage regulator module

A voltage regulator module includes a circuit board, a metallic winding assembly, a switching circuit and a magnetic core assembly. The circuit board includes an accommodation space, a first surface and a second surface. The accommodation space is formed within the circuit board and in communication with a first opening and a second opening. The metallic winding assembly includes third opening. A projection region of the switching circuit and a projection region of the metallic winding assembly on the first surface are partially overlapped with each other. The magnetic core assembly includes an upper core, a lower core and a lateral leg. The upper core and the lower core are disposed on the circuit board. The lateral leg is penetrated through the first opening, the third opening and the second opening. An inductor is defined by the magnetic core assembly and the metallic winding assembly collaboratively.

TRANSFORMER AND PACKAGE MODULE
20220254561 · 2022-08-11 ·

A transformer can include at least one magnetic core; a substrate having a planar winding inside; and where the substrate is stacked with at least one of the magnetic cores. A package module can include the transformer and a package backplane a package backplane that encapsulates a wafer; and where the package backplane is stacked with the transformer, and an upper surface of the package backplane is in contact with the magnetic core of the transformer.

TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE

A transformer device includes: a planar first coil; a first insulation layer being provided above the first coil; an intermediate layer being provided above the first insulation layer; a second insulation layer being provided above the intermediate layer; a planar second coil being provided above the second insulation layer and facing the first coil; and a pad having conductivity being provided above the second insulation layer and being connected to one end side of the second coil. The pad is disposed at a position at least partially overlapping the intermediate layer in plan view. The intermediate layer has hardness higher than hardness of the first insulation layer and the second insulation layer.

MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER
20220256700 · 2022-08-11 ·

The present invention provides a multi-functional printed circuit board (PCB) for assembling a plurality of components of a power converter in to a single package. The PCB comprises: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the plurality of components of the power converter.

MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER
20220256707 · 2022-08-11 ·

The present invention provides a multi-functional printed circuit board (PCB) for assembling a plurality of components of a power converter in to a single package. The PCB comprises: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the plurality of components of the power converter.

HIGH EFFICIENCY AND HIGH DENSITY GaN-BASED POWER CONVERTER
20220255447 · 2022-08-11 ·

The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.

HIGH EFFICIENCY AND HIGH DENSITY GaN-BASED POWER CONVERTER
20220255446 · 2022-08-11 ·

The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.

MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER AND METHOD FOR MANUFACTURING THE SAME
20220254885 · 2022-08-11 ·

The present invention provides a multi-functional printed circuit board (PCB) for assembling a plurality of components of a power converter in to a single package. The PCB comprises: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the plurality of components of the power converter.

Low noise multilayer transformer
11450470 · 2022-09-20 · ·

A magnetic structure in a power converter includes at least two multilayer boards, such as a primary board containing the primary windings and some auxiliary windings, and a secondary board containing the secondary windings and some auxiliary windings. The primary and secondary boards are on top of each other. On the layer on the primary bard adjacent to the secondary board, is a dual function shield to reduce the total common mode noise in the converter towards zero. The controlled dual function shield can be placed on the secondary board on the layer adjacent to the primary board, and in some embodiments can be placed on both primary and secondary board on the layers adjacent to the other board. The embodiments herein offer a very good solution for cost reduction of the planar transformers and offers an avenue for total elimination of the common mode noise in a power converter.

CONTINUOUS FOLDING PLANAR TRANSFORMER WINDING

Embodiments of planar transformer winding assemblies are provided herein. For example, a transformer winding assembly comprises a primary winding configured to connect to an upper surface of a flexible substrate comprising a plurality of conjoined annular rings, the primary winding runs along the plurality of conjoined annular rings in a first configuration and a secondary winding configured to connect to a lower surface of the flexible substrate, the secondary winding runs along the plurality of conjoined annular rings in a second configuration different from the first configuration.