A two-card assembly includes: a first printed wiring board; a second printed wiring board; a first stiffener secured to the first printed wiring board, the first stiffener interposed between the first printed wiring board and the second printed wiring board; a second stiffener secured to the second printed wiring board, the second stiffener interposed between the first stiffener and second printed wiring board; a transformer mounting plate interposed between the first stiffener and the second stiffener; and a planar transformer secured to the transformer mounting plate. The transformer mounting plate dissipates heat from the planar transformer.

A DC-DC converter includes an insulating substrate; a magnetic core embedded in the insulating substrate, the magnetic core having non-zero x, y and z dimensions of less than or equal to about 5.4 mm by about 5.4 mm by about 1.8 mm; separate primary and secondary transformer windings surrounding first and second regions of the magnetic core; and a control circuit including: an oscillator; a drive circuit coupled to the oscillator; and one or more switches coupled to the drive circuit; the drive circuit providing a switching signal to the one or more switches and energizing the one or more switches to provide a drive voltage to the primary transformer winding. The one or more switches are Field Effect Transistors implemented in a Silicon-on-Insulator configuration or as a Silicon-on-Sapphire configuration.

The present invention provides for a PCB transformer comprising a core and planar PCB winding, wherein the core has two legs extending from a table portion, and wherein a planar PCB winding extends around each of the said legs, and wherein the outer dimensions of the table portion in regions overlying the planar PCB windings match substantially the outer dimension of the planar PCB winding so as to achieve particularly efficient coupling between the winding and the core.

A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

A method for producing an inductive component and an inductive component are disclosed. In an embodiment an inductive component includes at least one spiral-shaped winding made of a conductive material and a carrier made of an insulating material, wherein the spiral-shaped winding is incorporated into the carrier.

For a substrate of a coil component, there are arranged a plurality of through-holes; the pattern-wiring is provided with a loop-shaped portion surrounding the circumference of a center hole which penetrates the substrate a pair of end portions which extend from that loop-shaped portion; and the neighboring two through-holes within the plurality of through-holes penetrate the substrate in a state that at least a part of each of the openings thereof superimpose each of the pair of end portions and is connected electrically with each of the end portions. In addition, the opening of one of the through-holes at one of the end portions within the pair of end portions is provided at a biased position close to the other of the end portions with respect to the center of the one of the end portions in the intersecting-direction.

A magnetic component has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a core 500 which passes through the primary coil 10 and the secondary coil 20; and a coil sealing part 50 which seals at least the primary coil 10 and the secondary coil 20, and a part or whole of region between the primary coil 10 and the secondary coil 20 and the core 500.

The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

The present disclosure discloses a PCB winding transformer. The PCB winding transformer includes a magnetic core and a coil board with a multilayer structure. The coil board includes a primary coil and a secondary coil wound around a magnetic core column of the magnetic core. The secondary coil is located in a first layer and a last layer, and the primary coil is located in intermediate layers. The number of turns of the secondary coil is less than that of the primary coil. At least one via hole for connecting the first layer and the last layer of the secondary coil is disposed in the coil board between an inner side of the primary coil and the magnetic core column.

A planar transformer for power transmission, having vertical and horizontal extents, includes a circuit board having a sandwich-type structure with at least three layers to form electrical conductors. First and second layers of these layers form outer layers of the circuit board, and each additional one of these layers forms an inner layer of the circuit board. An insulation material with a minimum thickness is arranged between all of these layers, with a number of at least three mutually galvanically isolated circuits. A first circuit forms a primary circuit and each additional circuit forms an equally entitled secondary circuit, having a magnetic core assembled from two interconnected magnetic core parts. A first core part with a central part and two outer legs forms a U shape. The circuit board has two recesses, and the two outer legs of the first core part are inserted into these recesses and connected to the second core part at their ends remote from the central part. A conductor is formed on at least one of the outer layers for exactly one single circuit of the at least three circuits, and a conductor of at least one circuit of the at least three circuits is wound around a first outer leg, and conductors of at least two additional circuits of the at least three circuits are wound around the second outer leg.