A power electronics device includes one or more electrical windings included in an insulating substrate. A cavity and a channel connected to the cavity are also included in the insulating substrate, and a magnetic core is located in the cavity. The device also includes primary and secondary side electrical components located on first and second regions of a principal surface of the insulating substrate. An isolation region is located on the principal surface of the insulating substrate between the first and second regions, and the channel extends from the cavity to a first channel opening at an outside edge of the insulating substrate such that, when viewed along a thickness direction of the insulating substrate, the isolation region completely overlaps the first channel.

A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.

A power conversion system is provided. The system includes a switch module, a resonant module, a magnetic conversion module, a bobbin and an iron core. The magnetic conversion module includes a primary winding and a PCB winding module. The PCB winding module includes a printed circuit board, a conductive layer disposed on at least one surface of the printed circuit board, and a switch unit disposed on the printed circuit board.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.

A device includes a substrate including a cavity, a magnetic core in the cavity, a first winding extending around the magnetic core, and a single channel that extends between the cavity and an exterior of the device and that defines an opening. The first winding includes vias along an exterior periphery of the magnetic core opposite to the channel.

Described is a hybrid electronic and magnetic structure that enables a transformer with fractional and reconfigurable effective turns ratios (e.g. 12:0.5, 12:2/3, 12:1, and 12:2) and hereinafter referred to as a Variable-Inverter-Rectifier-Transformer (VIRT). A VIRT is valuable in converters having wide operating voltage ranges and high step-up/down, as it offers a means to reduce turns count and copper loss within a transformer while facilitating voltage doubling and quadrupling. Such characteristics are beneficial for reducing the size of a transformer stage in many power electronics applications, such as USB wall chargers. In embodiments, a VIRT comprises a plurality of switching cells distributed around a magnetic core and coupled to half-turns wound through that core. By controlling operating modes of the switching cells, it is possible to gain control over flux paths and current paths in the transformer.

In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

A matrix transformer particularly suited to large voltage step-down, high current applications achieves increased good current sharing uniformity or air gap and electrical characteristics and reduced or eliminating termination losses, core losses and winding losses with a unitary magnetic core structure featuring sheets of magnetic material and a two-dimensional array of pillars on which windings, oriented in opposite directions on pillars that are adjacent in orthogonal directions, can be formed or placed comprising metallization on or embedded in a printed circuit board (PCB) structure. Magnetic flux density is reduced by at least one-half by dividing the magnetic flux in each pillar into two paths of increased width in the sheets of magnetic material. Magnetic flux density may be further decreased and flux uniformity improved by extending the sheets of magnetic material beyond a periphery defined by the pillar array.

A magnetic and electrical circuit element including magnetic-flux-conducting posts, and a multi-layer structure formed with an electrically-conductive material. The multi-layer structure includes multiple layers forming a stack of layers along a length of the posts, said multi-layer structure configured as primary and secondary windings of a transformer. The primary winding is embedded in the multi-layer structure and wound around the magnetic-flux-conducting posts in such a way that a magnetic field induced in each of the magnetic-flux-conducting posts has a magnetic field polarity opposite to a polarity of the respective magnetic field of the magnetic-flux-conducting post adjacent the respective magnetic-flux-conducting post. Around each of the magnetic-flux-conducting posts, there is a respective one of the secondary windings connected to a semiconductor device. The magnetic-flux-conducting posts are connected magnetically by continuous magnetic-flux-conducting plates, each of which is shaped to ensure a continuous flow of the magnetic field successively through adjacent magnetic-flux-conducting posts.