Patent classifications
H01F2027/2819
Component carrier comprising embedded magnet stack
A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
Component Carrier With Integrated Inductor and Manufacturing Method
Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.
TRANSFORMER DEVICE
A transformer device includes first conductive segments, second segments, and third conductive segments. The second segments include second conductive segments and first bridging segments. The first bridging segments are connected to the first conductive segments to form a first inductor. The third conductive segments include second bridging segments, and the third conductive segments are connected to the second conductive segments to form a second inductor. The first inductor is located on the second inductor. The first bridging segments and the first conductive segments form first interlaced portions along a first direction. The second bridging segments and the second conductive segments form second interlaced portions along a second direction. The first direction is different from the second direction.
Planar transformer with multilayer circuit board
A planar transformer includes a magnetic core and a multilayer printed circuit board. A primary winding of the planar transformer is formed by winding traces on several layers of the printed circuit board. A layer of the printed circuit board that has a winding trace of the primary winding has a winding trace of another winding of the planar transformer, such as a winding trace of an auxiliary winding or a winding trace of a shield winding. The planar transformer further includes a secondary winding. The secondary winding can be a solid wire or a winding trace on a layer of the printed circuit board.
PLANAR TRANSFORMER AND CONVERTER HAVING SAME
A planar transformer and a converter including the same include a first core unit including a first receiving portion extending in a first direction; a second core unit spaced from the first core unit, disposed in parallel with the first core unit in a second direction thereof, and including a second receiving portion extending in the first direction; a first coil unit including a first through hole formed in a center portion thereof and a first coil pattern passing through the first receiving portion and the second receiving portion around the first through hole to form a turn; and a second coil unit including a second through hole formed in a center portion thereof and aligned with the first through hole in a third direction thereof, and a second coil pattern passing through the first receiving portion and the second receiving portion around the second through hole.
Electronic device
An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.
Low noise multilayer transformer
A magnetic structure in a power converter includes at least two multilayer boards, such as a primary board containing the primary windings and some auxiliary windings, and a secondary board containing the secondary windings and some auxiliary windings. The primary and secondary boards are on top of each other. On the layer on the primary board adjacent to the secondary board, is a dual function shield to reduce the total common mode noise in the converter towards zero. The controlled dual function shield can be placed on the secondary board on the layer adjacent to the primary board, and in some embodiments can be placed on both primary and secondary board on the layers adjacent to the other board. The embodiments herein offer a very good solution for cost reduction of the planar transformers and offers an avenue for total elimination of the common mode noise in a power converter.
Coil component
A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
High efficiency and high density GaN-based power converter and method for manufacturing the same
The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.
Isolator
According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.