Patent classifications
H01F2027/2819
WIRING BOARD, PLANAR TRANSFORMER, AND METHOD OF MANUFACTURING THE WIRING BOARD
The present disclosure provides a wiring board including at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. The insulating layer has a through hole that extends through the insulating layer in a thickness direction. The connection conductor includes a metal member that is disposed in the through hole, and a joining portion that covers at least a part of an outer surface of the metal member and that joins the metal member to the first wiring layer and to the second wiring layer.
TRANSFORMER AND POWER SUPPLY APPARATUS INCLUDING THE SAME
A transformer includes a magnetic core having an inner space, a coil unit disposed within the magnetic core and including a primary coil and a secondary coil in which layers formed with conductive patterns are laminated, and a base configured to receive the magnetic core and the coil unit. A portion of the base is inserted into and disposed in the coil unit to be interposed between an output terminal coupled to the secondary coil and the magnetic core.
WIRING BOARD AND PLANAR TRANSFORMER
A wiring board includes at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. Of the first wiring layer and the second wiring layer, at least the first wiring layer includes an unfixing region that is not fixed to the insulating layer.
CIRCUIT DEVICE AND POWER CONVERTER
A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.
CIRCUIT DEVICE AND POWER CONVERSION DEVICE
A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.
Distributed planar inductor with multi-2D geometry for energy storage
A distributed planar inductor is provided with energy storage components featuring high energy storage density, multilayer winding and low copper losses. The inductor includes a magnetic core with a plurality of vertically oriented posts, a plurality of horizontally oriented plates coupled to define an interior, and a conductive winding extending through the interior. The vertical posts each include a plurality of energy storage elements coplanar in orientation with respect to the winding and having a substantially two dimensional structure. The conductive winding may comprise co-planar winding tracks extending through the interior, for example vertically coupled in parallel. A set of co-planar winding tracks may correspond to respective layers in a multilayer printed circuit board, and for example may comprise printed circuit board tracks vertically interconnected by vias extending there-through.
Transformer and power supply device including the same
A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.
Hybrid transformers for power supplies
Illustrative embodiments of hybrid transformers, power supplies, and methods relating to the same are disclosed. In at least one embodiment, a hybrid transformer includes first and second wire coils arranged on opposing surfaces of a printed circuit board (PCB), a core extending through the PCB, wherein the first and second coils are each wound around the core, and at least one header electrically coupling one of the first and second wire coils to the PCB.
Planar transformer employing insulating structure for performance improvement
A planar transformer employing an insulating structure for performance improvement includes: a pair of ferrite cores (110) including an upper core (110-1) and a lower core (110-2); a printed circuit board (120), which is disposed between the pair of ferrite cores (110), one end of which has primary via holes (121) electrically connecting primary coil patterns, and the other end of which has secondary via holes (123) electrically connecting secondary coil patterns; an insulating block (130-1) for receiving one side of the pair of ferrite cores (110); and an insulating base (130-2) disposed in the pair of ferrite cores (110) and fittedly coupled to the insulating block (130-1), wherein the insulating block (130-1) and the insulating base (130-2) receive a given region of the printed circuit board (120) at one side at which the secondary via holes (123) is disposed.
VIA FOR MAGNETIC CORE OF INDUCTIVE COMPONENT
Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.