An integrated inductor structure includes a first spiral coil, a second spiral coil and a connection metal segment. The first spiral coil includes a plurality of metal segments, a bridging segment and first to fourth terminals. The bridging segment connects the metal segments. The second spiral coil has fifth and sixth terminals. The connecting metal segment connects the third and fifth terminals and the fourth and the sixth terminals. The integrated inductor structure uses the first and second terminals as its input and output terminals. The first and third terminals are on a first imaginary line, which passes a central region of a region surrounded by the first spiral coil. The bridging segment and the central region of the region are on a second imaginary line. An included angle between the two imaginary lines is equal to or greater than 45 degrees and equal to or smaller than 90 degrees.

An insulation type step-down converter includes first and second step-down transformers each of which includes an input-side coil and an output-side coil. First, second, third, and fourth rectifier elements are connected in series with first, second, third, and fourth series coils, respectively, the first, second, third, and fourth series coils each having the output-side coil of the first step-down transformer and the output-side coil of the second step-down transformer connected in series. The first to fourth series coils are connected to smoothing coils. The connection is such that electric currents flow simultaneously only in one of the first and second series coils and one of the third and fourth series coils in an alternate manner, and electric currents flowing simultaneously in one of the first and second series coils and one of the third and fourth series coils are opposite in direction to each other.

A laminated transformer includes a magnetic substance layer, a coil lamination stacked on the magnetic substance layer, the coil lamination having formed thereinside a primary coil and a secondary coil, the primary coil being wound spirally in convolutions in a stacking direction, the secondary coil being wound spirally in convolutions in the stacking direction and formed inside the primary coil, a magnetic substance filling inside of the secondary coil in the coil lamination, and a non-magnetic substance filling a region between the primary coil and the secondary coil and filling outside of the primary coil in the coil lamination.

Magnetic cores are described for inductors, transformers and any other electrical wound components. The magnetic cores may have one or more gaps, which may be distributed and/or oblique, and which may be broken up into multiple non-contiguous gaps.

A transformer integrated type printed circuit board includes: a transformer including a core, a primary winding wire, and a secondary winding wire; and a printed circuit board including a surface layer and an internal layer in which wiring patterns are respectively formed, and having a plurality of insertion portions into which a plurality of leg portions of the core are respectively inserted. The primary winding wire is disposed in the surface layer of the printed circuit board so as to be wound between the leg portions, and the secondary winding wire is disposed in the internal layer of the printed circuit board so as to be wound between the leg portions. The primary winding wire is small in number of windings, is large in width, and is large in thickness, in comparison with the secondary winding wire.

An integrated system for signal and power transmission with galvanic isolation is disclosed. The integrated system comprises an insulative layer having a primary side and a secondary side; a planar signal transformer and a planar power transformer for signal and power transmission between the primary and the secondary sides of the insulative layer respectively. The planar signal transformer comprises two signal coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively. The planar power transformer includes two power coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively. Each of the two signal coupling elements and the two power coupling elements is embedded in at least one layer of a multi-layer printed circuit board. The integrated system of the present disclosure has a compact structure and is suitable for automatic assembly and manufacturing.

A magnetic device assembly is provided for maximizing the size of the magnetic components for a predetermined power converter module by co-locating and sharing input, output, and auxiliary terminals between the substrates for the power converter and the magnetic components. Wherein complete power module is the result of constructing the separate constituent parts which include an integrated magnetic substrate, magnetic elements mounted therein, a power converter substrate, associated incorporated components located top and bottom on the power converter substrate, a composite mechanical footprint as defined by the mechanical extents of the integrated magnetic substrate and power converter substrate, and a composite electrical pinout as defined by the input-output pins which are coincident to and co-located as those of the integrated magnetic and power converter substrates.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

An assembly apparatus includes a lid sealably seated on an enclosure, the lid having a rigid undulating inner surface removed from an enclosure sealing surface, a getter material disposed on the undulating inner surface; and a vapor chamber enclosed in the enclosure.

An electromagnetic induction device, and a power supply apparatus and a display apparatus having the same are disclosed, the electromagnetic induction device comprising: a substrate layer comprising at least one substrate configured to be laid one upon another and a thin-film coil pattern, which is formed on at least one of both surfaces of the substrate and through which an electric current of a signal flows, the at least one substrate having an opening provided at an inner area of the thin-film coil pattern; a core configured to have a shape corresponding to a circulation path of magnetic flux generated by change in an electric current flowing in the thin-film coil pattern, and arranged to penetrate the inner area of the thin-film coil pattern through the opening of the substrate layer; and a heat dissipation layer disposed on one surface of the substrate, the heat dissipation layer configured to dissipate heat from at least one of the substrate layer and the core. The disclosed configuration addresses the problem of heat dissipation in a thin flat-plate structure.