There is provided a device that includes a core, a first winding portion that turns around an outer circumference of the core, a plurality of sub-substrates each having a pattern of a second winding turning around the outer circumference of the core, and a main substrate on which a plurality of sub-substrates are mounted.

A planar transformer for power transmission, having vertical and horizontal extents, includes a circuit board having a sandwich-type structure with at least three layers to form electrical conductors. First and second layers of these layers form outer layers of the circuit board, and each additional one of these layers forms an inner layer of the circuit board. An insulation material with a minimum thickness is arranged between all of these layers, with a number of at least three mutually galvanically isolated circuits. A first circuit forms a primary circuit and each additional circuit forms an equally entitled secondary circuit, having a magnetic core assembled from two interconnected magnetic core parts. A first core part with a central part and two outer legs forms a U shape. The circuit board has two recesses, and the two outer legs of the first core part are inserted into these recesses and connected to the second core part at their ends remote from the central part. A conductor is formed on at least one of the outer layers for exactly one single circuit of the at least three circuits, and a conductor of at least one circuit of the at least three circuits is wound around a first outer leg, and conductors of at least two additional circuits of the at least three circuits are wound around the second outer leg.

The present disclosure discloses a PCB winding transformer and a coil board thereof. The PCB winding transformer comprises a coil board and a magnetic core. The coil board includes a primary coil and a secondary coil. The primary coil and the secondary coil are wound around a magnetic core column of the magnetic core. At least two via holes which correspond to the primary coil and the secondary coil respectively are disposed in the coil board. In the primary coil and the secondary coil, the via hole corresponding to the coil with less turns is disposed between an inner side of the coil with more turns and the magnetic core column.

A magnetic assembly includes a magnetic core, a magnetic core set, a circuit board and a positioning plate. The magnetic core set includes a first magnetic member, two second magnetic members and a plurality of third magnetic members. A plurality of separation spaces exist between the first magnetic member and two second magnetic members, and the circuit board is disposed between the magnetic core and the magnetic core set. The positioning plate has a first receptacle configured to receive the first magnetic member, two second receptacles each configured to receive one of the second magnetic members, and a plurality of third receptacles configured to receive the third magnetic members. Therefore, the eddy current loss and the winding loss are reduced, the sizes of the separation spaces are controlled precisely, and the advantages of enhancing the effectiveness of the magnetic assembly are achieved.

According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.

A transformer includes: a first coil section formed by coiling a conductor pattern in a planar state around an insertion hole provided on a circuit board; a second coil section that includes a first ring composed of a coil formed by coiling a conductor plate, the coil being covered with an electric-insulating resin, a second ring composed of a coil formed by coiling a conductor plate, the coil covered with the electric-insulating resin, and a coupled part formed by covering a coupled position between the first ring and the second ring with the electric-insulating resin; and core sections forming a closed magnetic circuit that magnetically couples the first coil section and the second coil section.

A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

A planar transmitter having a vertical extent and a horizontal extent, having a layer structure with a plurality of electrical circuits, wherein a first electrical circuit and a second electrical circuit are electrically conductively disconnected from one another. The transmitter also has at least one magnetic core which at least partially surrounds the layer structure and acts at least on the first electrical circuit and on the second electrical circuit, wherein the first electrical circuit and the second electrical circuit lie substantially in one plane and form one layer of the layer structure. Provision is further made for at least the first electrical circuit or the second electrical circuit to be subdivided into a plurality of electrical circuits which are electrically conductively disconnected from one another.

A magnetic isolator is described. The magnetic isolator may comprise a top conductive coil, a bottom conductive coil, and a dielectric layer separating the top conductive coil from the bottom conductive coil. The top conductive coil may comprise an outermost portion having multiple segments. The segments may be configured to reduce the peak electric field in a region of the dielectric layer near the outer edge of the top conductive coil. The top conductive coil may comprise a first lateral segment, and a second lateral segment that is laterally offset with respect to the first lateral segment. The first lateral segment may be closer to the center of the top conductive coil than the second lateral segment, and may be closer to the bottom conductive coil than the second lateral segment. The magnetic isolator may be formed using microfabrication techniques.

High-frequency amplifier apparatuses suitable for producing output powers of at least 1 kW at frequencies of at least 2 MHz for plasma excitation are disclosed. These high-frequency amplifiers include two transistors, the source or emitter connections of which are each connected to a ground connection point. The transistors can have an identical design and are arranged on a multilayer printed circuit board. The apparatus also includes a power transformer, the primary winding of which is connected to the drain or collector connections of the transistors. The primary winding and the secondary winding of the power transformer are each in the form of planar conductor tracks which are arranged in different upper layers of the multilayer printed circuit board.