An insulation type step-down converter includes first, second, third, and fourth secondary-side coils, and first, second, third, and fourth rectifier elements. The first, second, third, and fourth rectifier elements is capable of performing rectification such that electric currents flow alternately only in one of the first and second secondary-side coils and one of the third and fourth secondary-side coils, and electric currents flowing simultaneously in one of the first and second secondary-side coils and one of the third and fourth secondary-side coils are opposite in direction to each other so as to cancel out a magnetic flux passing through the middle leg each time when electric current flowing in the primary-side coil is changed in direction. Provided is an insulation type step-down converter which can minimize an increase in heat generated by the primary-side coil even at a large step-down ratio of a step-down transformer without raising manufacturing costs.

An electronic device includes a magnetic element, and a first circuit module. The magnetic element includes a magnetic core set and a winding assembled in the magnetic core set. The first circuit module is coupled to the first winding of the magnetic element. A vertical projection area of the first circuit module has an overlap portion with a vertical projection area of the winding of the magnetic core set on a first plane, and the first plane is a horizontal plane at which the winding is located.

An insulation type step-down converter includes first and second step-down transformers each of which includes an input-side coil and an output-side coil. An intermediate portion of the output-side coil of the first step-down transformer and an intermediate portion of the output-side coil of the second step-down transformer are connected to each other. First, second, third, and fourth rectifier elements are connected in series with first, second, third, and fourth output-side coils, respectively. Smoothing coils are connected to the first to fourth output-side coils. The first, second, third, and fourth rectifier elements are connected such that electric currents flow simultaneously in the first output-side coil and the third output-side coil, and electric currents flow simultaneously in the second output-side coil and the fourth output-side coil in a manner alternating with the electric currents in the first output-side coil and the third output-side coil.

The present invention provides a multi-functional printed circuit board (PCB) for assembling a plurality of components of a power converter in to a single package. The PCB comprises: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the plurality of components of the power converter.

In an embodiment a method for producing an inductive component includes applying a conductive material and an insulating material in an additive manufacturing process. The conductive material forms at least one winding having a plurality of superimposed turns and the insulating material forms a carrier for the at least one winding. The turns are connected to form a spiral-shaped winding.

Embodiments disclosed herein include power transformers for microelectronic devices. In an embodiment, a power transformer comprises a magnetic core that is a closed loop with an inner dimension and an outer dimension, and a primary winding around the magnetic core. In an embodiment, the primary winding has a first number of first turns connected in series around the magnetic core. In an embodiment, a secondary winding is around the magnetic core, and the secondary winding has a second number of second turns around the magnetic core. In an embodiment, individual ones of the second turns comprise a plurality of secondary segments connected in parallel.

An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate.

A magnetic component has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a core 500 which passes through the primary coil 10 and the secondary coil 20; and a coil sealing part 50 which seals at least the primary coil 10 and the secondary coil 20, and a part or whole of region between the primary coil 10 and the secondary coil 20 and the core 500.

A planar transformer includes: a first primary coil in a first layer of a printed circuit board (PCB); a first secondary coil in one or more second layers in the PCB; and a second secondary coil in the one or more second layers.

An isolator includes a substrate; a first planar coil provided above the substrate and along a surface of the substrate; a first insulating portion on the first planar coil; a second planar coil on the first insulating portion; and a metal layer above the first insulating portion. The first planar coil, the second planar coil, and the metal layer are arranged in a first direction perpendicular to the surface of the substrate. The first planar coil and the second planar coil each having a center and an outer perimeter in a second direction along the surface of the substrate. A distance in the second direction from the center of the first planar coil to the outer perimeter of the first planar coil is less than a distance in the second direction from the center of the second planar coil to the outer perimeter of the second planar coil.