An electronic device includes a magnetic element, and a first circuit module. The magnetic element includes a magnetic core set and a winding assembled in the magnetic core set. The first circuit module is coupled to the first winding of the magnetic element. A vertical projection area of the first circuit module has an overlap portion with a vertical projection area of the winding of the magnetic core set on a first plane, and the first plane is a horizontal plane at which the winding is located.

An isolated switching power supply of the present invention includes: a first circuit board provided with a pattern of a primary winding constituting an isolation transformer; a second circuit board provided with patterns of secondary windings constituting the isolation transformer, wherein a secondary winding pattern portion is arranged to face a primary winding pattern portion of the first circuit board at a predetermined interval; and a core inserted into the primary winding of the first circuit board and the secondary windings of the second circuit board and made of a magnetic body constituting the isolation transformer.

An insulation type step-down converter includes first and second step-down transformers each of which includes an input-side coil and an output-side coil. An intermediate portion of the output-side coil of the first step-down transformer and an intermediate portion of the output-side coil of the second step-down transformer are connected to each other. First, second, third, and fourth rectifier elements are connected in series with first, second, third, and fourth output-side coils, respectively. Smoothing coils are connected to the first to fourth output-side coils. The first, second, third, and fourth rectifier elements are connected such that electric currents flow simultaneously in the first output-side coil and the third output-side coil, and electric currents flow simultaneously in the second output-side coil and the fourth output-side coil in a manner alternating with the electric currents in the first output-side coil and the third output-side coil.

Aspects of the present disclosure include systems, structures, circuits, and methods providing planar transformers and planar transformer structures. The planar transformers and transformer structures can include first and second core layers of soft ferromagnetic material on opposite sides of an electrical substrate. First and second coils can be configured as conductive traces disposed on the opposite sides of the substrate. The first and second soft ferromagnetic layers are in contact in a contact region. One or more holes are disposed in either or both of the soft ferromagnetic layers and contain soft ferromagnetic material to reduce reluctance of the transformer structure. The planar transformer can be included in integrated circuit (chip) packages or modules. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a gate driver or other high voltage circuit.

An isolator includes a substrate; a first planar coil provided above the substrate and along a surface of the substrate; a first insulating portion on the first planar coil; a second planar coil on the first insulating portion; and a metal layer above the first insulating portion. The first planar coil, the second planar coil, and the metal layer are arranged in a first direction perpendicular to the surface of the substrate. The first planar coil and the second planar coil each having a center and an outer perimeter in a second direction along the surface of the substrate. A distance in the second direction from the center of the first planar coil to the outer perimeter of the first planar coil is less than a distance in the second direction from the center of the second planar coil to the outer perimeter of the second planar coil.

The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.

A planar transformer is provided, which comprises a plate-shaped conductor substrate with integrated primary winding, secondary winding and coupling winding. The conductor substrate has pairs of recesses, and a respective two-part ferromagnetic core having yoke legs is inserted through each pair of recesses. One leg of each core is surrounded by the primary winding or the secondary winding, while the coupling winding is looped around the remaining legs of the cores. At least a minimum total isolation separation distance made up of partial isolation separation distances between the coupling winding and adjacent yoke legs or adjacent windings is maintained for electrical isolation between the primary winding and the secondary winding.

A planar transformer includes a magnetic core and a multilayer printed circuit board. A primary winding of the planar transformer is formed by winding traces on several layers of the printed circuit board. A layer of the printed circuit board that has a winding trace of the primary winding has a winding trace of another winding of the planar transformer, such as a winding trace of an auxiliary winding or a winding trace of a shield winding. The planar transformer further includes a secondary winding. The secondary winding can be a solid wire or a winding trace on a layer of the printed circuit board.

The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.