A resonant converter includes a first circuit board, a second circuit board and a planar transformer. The planar transformer includes an iron core, a plurality of wirings, and a first conductive column. A first core column of the iron core penetrates a first circuit board through hole of the first circuit board and a second circuit board through hole of the second circuit board respectively. The wirings are formed around the first circuit board through hole and the second circuit board through hole respectively, and the first conductive column electrically connects the wirings arranged around the first circuit board through hole and the wirings arranged around the second circuit board through hole to form a winding of the planar transformer. The iron core is used to sleeve the winding of the first circuit board and the second circuit board to form the planar transformer.

A planar transformer includes a stack comprising a plurality of planar windings arranged one above the other, an outer core portion comprising a first plate and a second plate, an inner core portion extending between the first plate and the second plate, and at least one heat pipe. The planar windings are disposed between the first plate and the second plate. Each planar winding of the plurality of planar windings, the first plate and the second plate extend substantially parallel to each other. The at least one heat pipe extends substantially parallel to the plurality of planar windings and is disposed in a space formed between a planar winding of the plurality of planar windings and any of: another planar winding of the plurality of planar windings, the first plate, or the second plate.

A transformer includes: a magnetic core including a lower magnetic structure and an upper magnetic structure; a printed circuit board arranged between the lower magnetic structure and the upper magnetic structure and including a core hole through which a midsection of the magnetic core penetrates, a primary coil, a secondary coil, a primary via-hole formed at an end of the printed circuit board and electrically connected to the primary coil, and a secondary via-hole formed at another end of the printed circuit board and electrically connected to the secondary coil; a primary pin inserted into the primary via-hole; a secondary pin inserted into the secondary via-hole; an insulating block into which a portion of the printed circuit board is inserted; and a mount on which the printed circuit board and the insulating block are mounted.

An electronic device has a substrate, a signal wiring and a heat radiating wiring. The substrate has one surface and the other surface opposite to the one surface. The signal wiring is formed on an insulating layer of the substrate. The heat radiating wiring is formed on the insulating layer and thermally connected to the signal wiring on a same plane as the signal wiring.

An example printed circuit board (PCB) with integrated current sense includes a direct current (DC) bus including a first DC trace and a second DC trace. The PCB with integrated current sense further includes a planar Rogowski coil positioned between the first DC trace and the second DC trace and electrically separated from the first DC trace and the second DC trace. The planar Rogowski coil can extend beyond an edge-to-edge distance between a first side edge and a second side edge of the first DC trace in a first direction. The planar Rogowski coil can further extend beyond an edge-to-edge distance between a first edge and a second edge of the second DC trace in the first direction.

A power converter. In some embodiments, the power converter includes: a low-voltage switching circuit including a first port of the power converter; a transformer, having: a first winding connected to the low-voltage switching circuit, and a second winding; and a high-voltage switching circuit including a second port of the power converter and being connected to the second winding, wherein: the power converter is capable, for a first set of control parameter values, of transmitting power from the first port to the second port, with an efficiency of at least 90%, the first port being at a first voltage and the second port being at a voltage at least 50 times the first voltage.

An electronic circuit, the electronic circuit comprising a first die. The first die comprises a first coil; a second coil; and an electrically conductive loop that defines a first-die region within the loop, wherein the first coil is in the first-die region and the second coil is located outside the first-die region.

An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.

The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

A planar transformer assembly includes a primary coil, a multiplicity of secondary coils magnetically coupled to the primary coil, at least one printed circuit board, a multiplicity of layers formed on the at least one printed circuit board, and a multiplicity of groups of coil windings forming said primary coil and said multiplicity of secondary coils. Each group includes a first primary coil winding of said primary coil arranged on a first layer of said multiplicity of layers and a second primary coil winding of said primary coil arranged on a second layer of said multiplicity of layers, and a multiplicity of secondary coil windings of said multiplicity of secondary coils arranged on at least one intermediate layer of said multiplicity of layers in between said first layer and said second layer.