An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

An electronic board, in particular for a power electronics circuit such as a converter, comprises: a planar substrate having a first side and a second side opposite the first side; at least two magnetic core elements, called the first elements, arranged on the first side of the substrate and each having at least two legs passing through the substrate; and at least two windings, arranged around at least one leg of each first magnetic core; wherein: it also comprises a second magnetic core element in the form of a plate, arranged on the second side of the substrate and in contact with respective ends of the legs of at least two first elements; the first elements, the windings and the second element forming at least two mutually decoupled magnetic circuits.

A transformer structure includes at least three sections, each corresponding to metal layers of an integrated circuit. A first section of the at least three sections is electrically coupled to a third section with a second section disposed between the first and third sections. The at least three sections includes inductor coils, all of which are wound in a same direction and voltage phase starting at an outer terminal and continuing to an inner terminal of each inductor coil. At least one radial wiring channel passes through a portion of a coil in one of the three sections to provide an external connection to an internal terminal of the coil in at least one of the three sections.

Provided is an electrically insulated component for use in a planar transformer. The insulated component may include a planar transformer conductive component having a first surface, a second surface and a plurality of edges. The insulated component may also include a first layer including an oxidized metal coating, as well as a second layer including an electrophoretically deposited (EPD) insulating coating. The EDP coating may include a polymer and an inorganic material. The first layer and the second layer may cover at least the first surface and the plurality of edges of the conductive component and the first layer may be disposed between the conductive component and the second layer. Also provided is a method of manufacturing of the electrically insulated component.

A planar transformer includes a magnetic core having an internal opening. A plurality of high current capacity windings are disposed within the internal opening. These high current capacity windings have a length, a width and a thickness. Each winding is formed as an open loop having adjacent first and second end portions. There is at least one primary winding and one secondary winding. The primary winding and/or secondary winding may be high current capacity windings. A first terminal lead is electrically interconnected to multiple adjacent first end portions and a second terminal lead is electrically interconnected to multiple second end portions. Both the first terminal lead and said second terminal lead have a length, a width and a thickness measured with the thickness being less than either the terminal lead length or the terminal lead width.

Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

A planar matrix transformer assembly. In one embodiment, the assembly comprises (a) a core comprising multiple center posts in a matrix pattern; and multiple edge posts along edges of the core for a magnetic flux return path; (b) a single-turn layer comprising a top winding on the top the layer to form a single turn around each center post; and a bottom winding electrically coupled to the top winding and on the bottom of the layer to form a single turn around each center post; and (c) a multi-turn layer comprising multiple top-side windings on top of the layer, wherein each top-side winding is a multi-turn winding around a different center post; and multiple bottom-side windings on the bottom of the multi-turn layer, wherein each bottom-side winding is (i) electrically coupled to a different top-side winding in a one-to-one correspondence, and (ii) a multi-turn winding around a different center post.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

A power electronics device includes one or more electrical windings included in an insulating substrate. A cavity and a channel connected to the cavity are also included in the insulating substrate, and a magnetic core is located in the cavity. The device also includes primary and secondary side electrical components located on first and second regions of a principal surface of the insulating substrate. An isolation region is located on the principal surface of the insulating substrate between the first and second regions, and the channel extends from the cavity to a first channel opening at an outside edge of the insulating substrate such that, when viewed along a thickness direction of the insulating substrate, the isolation region completely overlaps the first channel.

A planar transformer employing an insulating structure for performance improvement includes: a pair of ferrite cores (110) including an upper core (110-1) and a lower core (110-2); a printed circuit board (120), which is disposed between the pair of ferrite cores (110), one end of which has primary via holes (121) electrically connecting primary coil patterns, and the other end of which has secondary via holes (123) electrically connecting secondary coil patterns; an insulating block (130-1) for receiving one side of the pair of ferrite cores (110); and an insulating base (130-2) disposed in the pair of ferrite cores (110) and fittedly coupled to the insulating block (130-1), wherein the insulating block (130-1) and the insulating base (130-2) receive a given region of the printed circuit board (120) at one side at which the secondary via holes (123) is disposed.