To provide a coil device having high bonding strength and bonding reliability.

The coil device 1 has a core member 10 having a winding core and a flange 12, a wire 32 wound around the winding core, and a terminal electrode 52 connected with a lead 32a of a wire 32 provided to the flange 12; and an easy bonding layer 70 is formed on the surface of the terminal electrode 52 connected with the lead 32a in a stripe form 70a. the stripe form each bonding layer 70a is formed as a laser mark 71. In the coil device 1, a residue of coating film 78 which may be generated when the lead 32a of the wire 32 is connected to the mounting part 65 of the terminal electrode 52 is removed by laser.

A coil component includes: a base member made of a resin, the base member having a bobbin part and a terminal holder; a coil wound around the bobbin part; and a plurality of terminal members made of a metal. The terminal members are held by the terminal holder while being partially embedded therein, and each has the coil electrically connected thereto. A part of each terminal member, which protrudes out from the terminal holder, includes: a mounting terminal part; and a standoff part that is arranged at a position different, in a bottom view, from the mounting terminal part, and exposes to the lower face side of the coil component.

A method and apparatus are described for fabricating a microchip structure (60A) which includes a first chip (41) that is affixed to a lead frame strip (11-18) having a plurality of lead frame pads (11-16) in a circuit mounting area (19) and a planar lead frame inductor coil (17) that is laterally displaced from the circuit mounting area (19), where molded body (61) encapsulates the first chip (41), lead frame pads (11-16) and planar lead frame inductor coil (17).

A coil device comprising, the core body having a coil core part and a core bottom face, and a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by the conductive resin electrode.

A coil component 100 includes a first coil element 111 and a second coil element 112 each formed in an angular-tubular shape and disposed in parallel by winding and laminating a single flat wire 101 in one direction with edgewise-winding between one end portion 101A and another end portion 101B and bending the wound and laminated coil into two, and includes an interconnection part 113 for connecting the both elements. The interconnection part 113 includes a coil element winding end portion side raised part 123A, a coil element winding start portion side raised part 123B, and an intermediate part 123C extended between the two raised parts 123A and 123B.

A coil device having high bonding strength and bonding reliability has a core member including a winding core and a flange, wires wound around the winding core and one end being positioned at the flange, and terminal electrodes provided to the flange. Each of the terminal electrodes has a wire connecting part where one ends of the wires are connected, and a mounting part continuously formed with the wire connecting part at the side close to the winding core with respect to the wire connecting part along the axis direction of the winding core. The wire connecting part is provided at a position lower than the mounting part along the height direction of the flange.

A coil component includes a mold portion having a first surface and the second surface opposing each other, a winding coil disposed in the second surface of the mold portion, a cover portion disposed on the mold portion and the winding coil, and accommodating grooves on the first surface of the mold portion to be spaced apart from each other, and in which both ends of the winding coil are disposed, the accommodating grooves extend from one side of the mold portion in a width direction, and a minimum distance from the accommodating grooves to the second surface of the mold portion increases or decreased in the width direction.

A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.

A potting box for assembling a transformer comprises an inner wall and an outer wall. The inner wall is sleeved in the outer wall. A bottom plate connected to a bottom portion of the inner wall and a bottom portion of the outer wall to form a potting space for accommodating a first winding and a second winding. An inner side of the outer wall comprises a first support portion for supporting the first winding and an outer side of the inner wall comprises a second support portion for supporting the second winding. An iron core of the transformer penetrates through an inner side of the inner wall.

A transformer comprises an iron core, a support module, a winding unit, a potting box. The potting box includes an inner wall, an outer wall and a bottom plate and the inner wall is sleeved in the outer wall. The bottom plate is connected to a bottom portion of the inner wall and a bottom portion of the outer wall and a potting space is defined by the outer wall, the inner wall and the bottom plate. The winding unit is disposed in the potting space and a magnetic pole of the iron core penetrates through an inner side of the inner wall of the potting box. The support module is disposed between at least one end surface of the potting box and a cover of the iron core to form an insulation clearance. The support module is close to the inner wall of the potting box.