An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover at least parts of first and second end surfaces. A stacking direction and a coil axis direction are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction is from 85% to 95% of a length of the multilayer body. A distance between coil conductors adjacent to each other in the stacking direction lies in a range from 12 μm to 40 μm.

Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

A coil component includes a body and a coil conductor embedded in the body. The body includes a magnetic layer and a non-magnetic layer. The magnetic layer is formed of a composite material including a metal particle and a resin material, and the non-magnetic layer is arranged to block between at least one of top and bottom surfaces of the body and the coil conductor.

A laminated coil component 1 includes an element body 2, a coil 8 disposed in the element body 2, and a first external electrode 4 and a second external electrode 5, and at least a part of the coil 8 is disposed in a first region A1 and a second region A2 when seen in a facing direction of the pair of side surfaces 2e and 2f, and the coil 8 is not disposed in a third region A3 and a fourth region A4 when seen in the facing direction of the pair of side surfaces 2e and 2f.

A surface-mounted inductor including a coil having a wound part formed by winding a conductive wire and extended parts extended from an outer circumference of the wound part, a molded body containing the coil, constituted by a composite material containing a magnetic powder, and outer terminals connected to end portions of the extended parts disposed on a mounting surface. The wound part is contained within the molded body so that a winding axis is parallel to the mounting surface. The extended parts are extended toward the mounting surface side, each end portion of the extended parts are exposed from the surface thereof of the molded body. In the molded body, a density of a magnetic powder between the end portions of the extended parts on the mounting-side surface is lower than a density in the surface on the opposite side from the mounting surface.

A coil component includes a winding core that includes a winding core portion, a first flange portion, and a second flange portion. The coil component further includes a plate core that has a main surface facing the winding core portion, the first flange portion, and the second flange portion, that extends between the first flange portion and the second flange portion, and that is secured to the winding core by using adhesive. Each of the first flange portion and the second flange portion has an upper surface that faces the main surface of the plate core. Recessed portions are formed on the corresponding upper surfaces. Protrusions may be formed in corresponding regions in which the recessed portions are formed.

A wire-wound inductor component includes a core including an axial portion that extends in an axial direction and is pillar-shaped and a first support and a second support disposed respectively on a first end and a second end in the axial direction of the axial portion; a first terminal electrode and a second terminal electrode disposed respectively on a bottom face of the first support and a bottom face of the second support; a wire wound around the axial portion, with first and second end portions of the wire being connected respectively to the first and second terminal electrodes; and a cover member that covers at least part of the wire on an upper face of the axial portion and has a terminal indentation depth of 0.85 μm or more. The adhesive strength of a top face of the cover member is less than or equal to 3.28 gf/mm.sup.2.

An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.

In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.