Patent classifications
H01F27/292
Coil component
In a coil component, a second magnetic portion disposed in the vicinity of a coil is designed to have a higher proportion of Fe than a metal magnetic powder-containing resin constituting a first magnetic portion. Therefore, a magnetic flux of the coil flows smoothly. Although the second magnetic portion has a relatively lower withstand voltage than the first magnetic portion, since the second magnetic portion is surrounded by the first magnetic portion, it is not exposed on an outer surface of a magnetic body. For this reason, a situation in which the coil and external terminal electrodes are short-circuited with the second magnetic portion therebetween is effectively curbed, and short-circuiting between the coil and the external terminal electrodes can be curbed.
Method for manufacturing electronic-component
A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.
Core component
In an embodiment a core component includes a base plate, a plurality of members arranged on corners of the base plate and delimiting an inner region of the core component and a center piece located in the inner region and having an oval basic shape.
COIL COMPONENT
Bonding strength between a core and a top plate is increased in a coil component. Surface roughnesses of a top surface of a flange portion of the core and a lower main surface of the top plate are different. For example, the surface roughness of the lower main surface is smaller than the surface roughness of the top surface. A protrusion protruding from the lower main surface having smaller surface roughness and in contact with the top surface of the flange portion of the core is in a region where the lower main surface of the top plate and the top surface of the flange portion of the core face each other with an adhesive interposed therebetween. The protrusion can increase a surface area of a bonding surface of the top plate having smaller surface roughness, and provide an anchor effect of the adhesive on the top plate.
INDUCTOR COMPONENT AND MOUNTING STRUCTURE OF INDUCTOR COMPONENT
An inductor component includes an element body, a coil on the body and spirally wound along an axis, first and second external electrodes electrically connected to the coil, and first and second through wirings which penetrate a substrate of the element body between main surfaces. The first coil wirings and through wirings, and the second coil wirings and through wirings, are connected as follows. With respect to two of the first through wirings adjacent to each other in a direction of the axis, on the first main surface, a relationship between a radius of an equivalent circle diameter of an end surface of each of the first through wirings and a minimum distance between end surfaces of the two first through wirings is satisfied, and with respect to two of the second through wirings adjacent to each other in the direction of the axis, a similar relationship is satisfied.
COIL COMPONENT
A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.
Coil component
A coil component according to one embodiment of the present invention includes: a base body having a plurality of magnetic layers; a first external electrode provided on the base body; a second external electrode provided on the base body and spaced from the first external electrode; a coil conductor provided in the base body; a first lead-out conductor including a first lead-out conductor first pattern and a first lead-out conductor second pattern; and a second lead-out conductor connecting a second end of the coil conductor and the second external electrode. The first lead-out conductor first pattern is provided between the magnetic layers so as to be connected to a first end of the coil conductor and the first external electrode. The first lead-out conductor second pattern is provided between the magnetic layers so as to be connected to the first lead-out conductor first pattern and the first external electrode.
Coil component
A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.
CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
COIL COMPONENT
A coil component includes a body including a first surface and a second surface disposed to oppose each other in a first direction, a first coil unit disposed in the body, and including a support member and a coil pattern disposed on at least one surface of the support member, a second coil unit disposed in the body, and including a wire-wound type coil; and a plurality of external electrodes connected to the first and second coil units, wherein a core axis of the first coil unit is not parallel to a core axis of the second coil unit.