A semiconductor structure in which the upper and lower semiconductor wafers are bonded by a hybrid bonding method is provided. The two semiconductor wafers each have discontinuous multiple metal traces or spiral coil-shaped metal traces. By hybrid bonding the two semiconductor wafers, multiple discontinuous metal traces are bonded together to form an inductance element with a continuous and non-intersecting path, or the two spiral coil-shaped metal traces are bonded together to form an inductance element. In this semiconductor structure, the inductance element formed by hybrid bonding has the advantage that the inductance value is easily adjusted.

The present application discloses a magnetic component, comprising a magnetic core comprising at least one core column; a winding winded on the core column and comprising a first coil and a second coil adjacent to the first coil; a cladding member covered on at least a portion of an external surface of the first coil; and a positioning member extending from the cladding member and the first coil, wherein the second coil is pressed on the positioning member.

A method of forming an aerosol provision device inductor coil comprises providing a litz wire comprising a plurality of wire strands, wherein each of the plurality of wire strands comprise a bondable coating. The method further comprises forming an inductor coil from the litz wire on a support member, wherein the inductor coil has a predetermined shape. The method further comprises activating the bondable coating such that the inductor coil substantially retains the predetermined shape, and removing the inductor coil from the support member.

An example telemetry system includes telemetry circuitry configured to communicate with a first device and being located on a circuit board. The telemetry system includes a first bobbin, the first bobbin being located on a first side of the circuit board. The telemetry system includes a first coil, the first coil being wound on the first bobbin in a first direction. The telemetry system includes a second bobbin, the second bobbin being located on a second side of the circuit board. The telemetry system includes a second coil, the second coil being wound on a second bobbin in a second direction, the second direction being opposite the first direction. An outer loop of the first coil and an outer loop of the second coil are electrically coupled together.

An inductor component includes a core having an annular shape; an insulating member that covers a portion of the core; a coil wound around the core and the insulating member; and a buffer member that is elastic. The core has a first face, a second face that crosses the first face, and a third face that faces the second face and crosses the first face. The insulating member is provided to cover the first face, a portion of the second face, and a portion of the third face. The core and the insulating member are bonded to each other with the buffer member interposed therebetween.

A winding arrangement for a transformer includes a plurality of stabilising elements, a winding block, a top end press element and a bottom end press element. The top end press element is arranged on a top end of the winding block and the bottom end press element is arranged on a bottom end of the winding block. The plurality of stabilising elements are arranged to make the winding arrangement self-supporting and isolated from short circuit forces, wherein the at least one stabilising element comprises any one out of: at least one insulated tie-rod made of fibre glass or plastic, arranged between the top end press element and the bottom end press element and at least one insulated band arranged around the winding block, the top end press element and the bottom end press element.

An electric transformer comprising a first magnetic circuit coupling a primary coil and a secondary coil, the first magnetic circuit comprising a first limb extending along a vertical axis, the primary coil comprising inner and outer primary coils connected in series, the inner primary coil, the secondary coil, and the outer primary coil being cylindrical and arranged concentrically around the first limb, wherein the inner primary coil, the secondary coil and the outer primary coil are mounted in a manner to maintain a predefined inner gap between the inner primary coil and the secondary coil and a predefined outer gap between the secondary coil and the outer primary coil, the inner and outer gaps being evaluated along a radial direction relative to the vertical axis, the inner and outer gaps increasing a leakage of a magnetic flux between the first coil and the secondary coil. The electric transformer comprising an additional second magnetic circuit having selected limb(s) that pass through predefined gap(s) between coils thereby providing preferred increase in leakage magnetic flux between the first coil and the secondary coil.

An inductor includes an annular core, and a first coil and a second coil which are wound around the core. The core has an internal surface, an external surface, a first end surface, and a second end surface. The first coil and the second coil include a first coil piece having a length of one turn and a second coil piece having a length of one turn. The first coil piece and the second coil piece surround the internal surface, the first end surface, the external surface, and the second end surface of the core. The first coil piece has, at its tip, a joint portion to be joined to the second coil piece, and the second coil piece has, at its tip, a joint surface to be in contact with the joint portion. Thus, the resistance value of the coil is reduced.

In some examples, an isolation transformer can include a first wire having a first insulation thickness and a second wire having a second insulation thickness that is different than the first insulation thickness. The isolation transformer can further include a plurality of magnetic cores of magnetic material that can be configured to surround portions of each of the first and second wires along respective circumferences of the first and second wires to provide the isolation transformer.

An on-chip inductor includes a semiconductor substrate, a plurality of insulating layers stacked over the semiconductor substrate, and first, second and third spiral-shaped coil patterns. The first, second and third spiral-shaped coil patterns are inductively coupled to each other and sequentially disposed on respective layers among the plurality of insulating layers. Further, the first, second and third spiral-shaped coil patterns have respective first ends overlapping each other. The on-chip inductor further includes a first via connecting the respective first ends of the first and second spiral-shaped coil patterns to each other, and a second via connecting the respective first ends of the second and third spiral-shaped coil patterns to each other, where the first and second vias overlap each other.