A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.

A coil component includes a body; an internal insulating layer buried in the body; insulating walls disposed on the internal insulating layer, and including openings each having a planar coil shape having at least one turn; coil patterns including first conductive layers disposed in the openings, and second conductive layers disposed between the first conductive layers and internal surfaces of the openings, and each having a first surface in contact with the internal insulating layer and a second surface opposing the first surface; and a recessed portion formed on the second surface of each of the coil patterns and exposing at least portions of the openings of the internal walls.

A coil component includes a body, a support substrate disposed in the body, a coil unit including a coil pattern disposed on the support substrate and perpendicular to a first surface of the body and first and second lead portions exposed to the first surface of the body and spaced apart from each other, and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to the first and second lead portions, respectively, wherein each of the first and second lead portions and the coil pattern includes a first metal layer disposed on the support substrate and each of the first and second lead portions further includes a second metal layer disposed on the first metal layer.

Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.

Non-liquid immersed transformers and methods of measuring aging degree of the transformers' insulation are disclosed. The transformers comprise a solid insulation inside the conductive coil and one or more floating electrodes in the solid insulation. At least a part of the conductive coil and the one or more floating electrodes may form one or more capacitive elements, respectively. An electrical parameter, e.g. complex permittivity, of the capacitive element is measured and the aging degree is calculated as a function of the electrical parameter measurement.

The present application discloses a magnetic component, comprising a magnetic core comprising at least one core column; a winding winded on the core column and comprising a first coil and a second coil adjacent to the first coil; a cladding member covered on at least a portion of an external surface of the first coil; and a positioning member extending from the cladding member and the first coil, wherein the second coil is pressed on the positioning member.

A pair of terminal electrodes 4 and 5 have electrode parts 4a and 5a and electrode parts 4b and 5b when viewed from a stacking direction, respectively. A plurality of connection conductors are disposed at positions not overlapping a plurality of coil conductors when viewed from the stacking direction. At least two of the plurality of connection conductors are disposed in a first region A1 or a second region A2 between the terminal electrodes 4 and 5 and an outer edge 9a of a coil 9 when viewed from the stacking direction. The first region A1 and the second region A2 overlap the electrode parts 4a and 5a when viewed from the facing direction of a pair of end surfaces 2a and 2b and overlap the electrode parts 4b and 5b when viewed from the facing direction of a pair of main surfaces 2c and 2d.

A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.

An inductor component including a spiral wiring wound into a planar shape. A first magnetic layer and a second magnetic layer are located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring. A vertical wiring extending from the spiral wiring in the normal direction penetrates the inside of the first magnetic layer or the second magnetic layer.

An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.