Patent classifications
H01F27/323
Coil electronic component
A coil electronic component includes a support substrate having a through-hole. First and second coil patterns are disposed on a first surface and a second surface of the support substrate opposing each other, respectively, and each surround the through-hole and are coiled. An encapsulant encapsulates at least portions of the support substrate and the first and second coil patterns, and external electrodes are disposed externally of the encapsulant and are each connected to a respective lead-out pattern connected to a respective one of the first and second coil patterns. A groove penetrates the first surface of the support substrate in a region of the first surface in which the first coil pattern is not disposed, and the second coil pattern is disposed in a region of the second surface of the support substrate that overlaps along a thickness direction with the groove penetrating the first surface.
COMPONENT AND METHOD FOR MANUFACTURING INSULATING SPACERS
A component for manufacturing an insulating spacer for electromagnetic induction apparatuses. Said component is formed by a body of plastic material having opposite first and second surfaces, opposite first and second sides and opposite third and fourth sides, a first distance between said first and second surfaces. At least one of said first and second sides comprises coupling means for coupling with complementary coupling means of a further one of such component for manufacturing said insulating spacer.
WATERPROOF TRANSFORMER COIL STRUCTURE AND MANUFACTURING METHOD THEREOF
Disclosed are a waterproof transformer coil structure and a manufacturing method thereof. The waterproof transformer coil structure includes: an insulating cylinder configured for supporting a transformer coil; a strut configured for being wound with the transformer coil, where the strut is mounted on the insulating cylinder, and the strut is provided with strip-shaped notches; and a winding wire, where the winding wire is wound on the strip-shaped notches.
Coil assembly
A coil assembly includes: a connection substrate including a coil pad and an accommodating portion disposed in a position adjacent to the coil pad; and a coil portion including a spiral wiring and an end portion bonded to the coil pad, wherein at least a portion of the coil portion is disposed in the accommodating portion.
INDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
An inductor structure and a manufacturing method for the same are provided. The inductor structure includes conductive layers and conductive elements. The conductive layers overlap in a vertical direction. Each of the conductive elements is coupled between two conductive layers of the conductive layers.
MIXTURE FOR FORMING A MULTILAYER INDUCTOR AND THE FABRICATION METHOD THEREOF
A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.
COIL COMPONENT
A coil component includes: a body having one surface and the other surface opposing each other and a plurality of walls connecting the one surface and the other surface to each other; a coil portion disposed within the body; first and second external electrodes disposed on the one surface of the body while being spaced apart from each other and connected to the coil portion; a first insulating layer disposed on the other surface of the body and extending to at least a portion of each of the plurality of walls of the body; and a second insulating layer disposed on the one surface of the body.
Multilayer coil component
A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The insulating layers between the coil conductors are composed of a material containing at least one out of a magnetic material and a non-magnetic material. A content percentage of the non-magnetic material in the insulating layers changes in a direction from a first end surface toward a second end surface of the multilayer body.
ELECTRONIC COMPONENT AND COIL COMPONENT
An electronic component includes a body having a mounting surface which faces a mounting substrate and an exposure surface from which an extended wiring line is exposed, a first electrode attached to the mounting surface, and a second electrode which is electrically connected to the extended wiring line and which is attached to the exposure surface. The first electrode and the second electrode second electrode are spaced from each other.
COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE
A coil component includes a coil part. The coil part includes a first turn part extending around a coil axis running in an axial direction, a second turn part outside the first turn part in a radial direction orthogonal to the axial direction and centered on the coil axis, and an insulating coating film covering a surface of the coil part. The first turn part has first inner and outer peripheral surfaces facing each other, and the first outer peripheral surface is depressed inwardly in the radial direction when seen in a section of the coil component along a plane passing through the coil axis, and the second turn part has second inner and outer peripheral surfaces facing each other, and the second inner peripheral surface faces the first outer peripheral surface and protrudes inwardly in the radial direction when seen in the section.