An inductive component is provided, including: a wire winding, around which a magnetic foil is wrapped; an electrical shielding, which surrounds the magnetic foil, the magnetic foil including at least one magnetic layer, the at least one magnetic layer including a magnetic material, and the magnetic material being a nanocrystalline iron alloy; and a non-magnetic and non-conductive insulating layer, which includes a plastic and which is disposed between the magnetic foil and the wire winding. A method for adjusting an inductance value of an inductive component is also provided.

Provided is a power inductor. The power inductor includes a body including metal powder and an insulation material, at least one base provided in the body, at least one coil pattern disposed on at least one surface of the base, and an external electrode disposed on each of at least two side surfaces of the body. At least a portion of the external electrode is made of the same material as the coil pattern.

A coil component including an element assembly that contains a filler and a resin material, a coil portion composed of a coil conductor that is embedded in the element assembly, and a pair of outer electrodes electrically connected to the coil conductor. The outer electrodes are disposed on a lower surface, and the coil axis of the coil portion is parallel to a mounting surface.

Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.

An inductor device, a filter device, and a steering system. The inductor device includes first to third cores and first and second wires. The first core, a portion of the first wire passing through the first core, and a portion of the second wire passing through the first core are provided as a first inductor. The second core and another portion of the first wire passing through the second core are provided as a second inductor. The third core and another portion of the second wire passing through the third core are provided as a third inductor.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

In the coil component, the external terminal and the metal magnetic powder-containing resin constituting the element body are not in direct contact with each other, and thus high ESD resistance is obtained. That is, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown is less likely to occur, and an improvement in breakdown voltage with respect to the transient voltage can be realized.

In a coil component includes an insulating layer interposed between an external terminal and an element body and formed in an entire region excluding a connection region in a formation region in which the external terminal is formed, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown does not occur or hardly occurs because of the insulating layer.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.