H01F27/363

Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same

A semiconductor device includes an inductance structure and a shielding structure. The shielding structure is arranged to at least partially shield the inductance structure from external electromagnetic fields. The shielding structure includes a shielding structure portion arranged along a side of the inductance structure such that the shielding structure portion is around at least a portion of a perimeter of the inductance structure.

HYBRID CORE MAGNETICS

A magnetic device, including a hybrid core including a first magnetic material as a first flux path that carries a low-frequency flux component and a second magnetic material as a second flux path that carries a high-frequency flux component that is a higher frequency flux component than the low-frequency flux component, in which the hybrid core controls distribution of the low-frequency flux component and substantially separates the low-frequency flux component and the high-frequency component; and at least one set of winding turns. The hybrid core includes at least one air gap to provide control over inductance of the magnetic device.

SEMICONDUCTOR DEVICE
20220367603 · 2022-11-17 ·

A semiconductor device includes a semiconductor chip that has a main surface, an insulating layer that is formed on the main surface, a functional device that is formed in at least one among the semiconductor chip and the insulating layer, a low potential terminal that is formed on the insulating layer and is electrically connected to the functional device, a high potential terminal that is formed on the insulating layer at an interval from the low potential terminal and is electrically connected to the functional device, and a seal conductor that is embedded as a wall in the insulating layer such as to demarcate a region including the functional device, the low potential terminal and the high potential terminal from another region in plan view, and is electrically separated from the semiconductor chip, the functional device, the low potential terminal and the high potential terminal.

INSULATING DEVICE

An insulating device includes a first electrode, a second electrode, and an insulating film. The insulating film is located between the first electrode and the second electrode. The insulating film includes a positive charged region. The positive charged region is located at a portion in a direction from the first electrode toward the second electrode.

Coil component

A coil component includes a body having one surface and the other surface opposing each other in one direction, and a plurality of walls each connecting the one surface to the other surface; a coil portion buried in the body, and having both ends exposing to one of the plurality of walls of the body; first and second external electrodes respectively including first and second terminal electrodes disposed on one surface of the body and spaced apart from each other, and first and second connection electrodes respectively connecting the first and second terminal electrodes to both ends of the coil portion; a first external insulating layer disposed on the other surface of the body; and a first shielding layer disposed on the external insulating layer.

Patterned ground shield device including multiple pattered ground shield layers

A patterned ground shield device includes a first patterned ground shield layer and a second patterned ground shield layer. The first patterned ground shield layer is located on a first layer, and the second patterned ground shield layer is located on a second layer. The first patterned ground shield layer includes a plurality of first strip-shaped structures, and each of the first strip-shaped structures includes an oxide diffusion material. The second patterned ground shield layer includes a plurality of second strip-shaped structures, and each of the second strip-shaped structures includes a conductive material, wherein the first strip-shaped structures and the second strip-shaped structures are disposed to each other in an interlaced manner.

Induction charging device
11498439 · 2022-11-15 · ·

The present disclosure describes an induction charging device for a partially or fully electrically operated motor vehicle. The induction charging device includes at least one charging coil and a temperature-control assembly including a fluid pipe for a liquid fluid. The charging coil is inductively couplable to a primary coil such that a battery can be inductively charged in the motor vehicle. The charging coil is heat-transmittingly connected to the fluid pipe such that the waste heat from the charging coil can be transmitted to the fluid. The induction charging device further includes a metal shielding plate for shielding electromagnetic field emissions, and a ferrite assembly for directing an electromagnetic alternating field. The charging coil is arranged in the fluid pipe such that the fluid can flow around it on all sides. The charging coil is secured in the fluid pipe directly or via a retaining device.

Modular and efficient wireless power transfer systems with a wired charging mode
11495998 · 2022-11-08 ·

A device comprises a plurality of power converters, a resonator block and a connection block. The plurality of power converters is coupled to a power port having a voltage. Each power converter comprises a plurality of switch networks, and each switch network has a plurality of power switches. The resonator block comprises a plurality of resonators. Each resonator has a resonant capacitor and is coupled to one of the plurality of power converters. The connection block comprises a switching component and is coupled to one of the plurality of resonators, and the connection block and the said resonator are configured such that the device operates in a wireless charging mode with the resonator block activated or a wired charging mode with the connection block activated.

Transformer structure
11495400 · 2022-11-08 ·

A transformer comprising a primary winding and a secondary winding. The primary winding has N.sub.2 number turns and having a first terminal and a second terminal. The secondary winding has having N.sub.1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N.sub.1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N.sub.2:(N.sub.3/N.sub.1) where N.sub.2 is an integer equal to or greater than 1, N.sub.1 is an integer greater than or equal to 2, and N.sub.3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.

Filter module
11496106 · 2022-11-08 · ·

A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.