A coil component includes a main body portion containing resin and having a hole portion, a coil provided in the main body portion, and a substantially cylindrical pipe arranged inside the hole portion. The coil includes an inner wiring embedded in the pipe and an outer wiring exposed from the main body portion. The inner wiring and the outer wiring are integrally continuous.

An inductor includes a coil that is constituted by a conductor having a coating layer and includes a winding portion where the conductor is wound and an extended portion extended from the winding portion, a base body that envelops the coil and is constituted by a magnetic body containing magnetic powder and resin, and an outer electrode that is arranged on a surface of the base body and connected to the extended portion. The extended portion of the coil includes a conductor portion that does not have the coating layer in an end portion of the extended portion, and the conductor portion includes a first region connected to the outer electrode and a second region in contact with the magnetic body.

A coil component includes a body; a support substrate embedded in the body; a coil portion disposed on the support substrate, and having an end portion exposed to a surface of the body; and an external electrode disposed on the surface of the body, and in contact with and connected to the end portion of the coil portion. An interface between the end portion of the coil portion and the external electrode, and an interface between the surface of the body and the external electrode are located on levels different from each other.

A coil component includes a body, a support substrate embedded in the body, a coil portion including first and second lead-out portions disposed on one surface of a support substrate and spaced apart from each other, slit portions formed along edge portions between both end surfaces of the body, opposing each other, and a first surface of the body, respectively, and exposing the first and second lead-out portions to internal surfaces of the slit portions, respectively, plating prevention portions embedded in the first and second lead-out portions, respectively, and having first surfaces exposed to the internal surfaces of the slit portions, respectively, and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, extending to the internal surfaces of the slit portions, respectively, and connected to the first and second lead-out portions, respectively.

A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.

A coil component in which occurrence of plating elongation is further suppressed and an inductance value is higher. A coil component includes an element body including metal magnetic particles, a coil conductor inside the element body, and a plurality of external electrodes on a surface of the element body. The element body has a substantially rectangular parallelepiped shape including upper and lower surfaces substantially orthogonal to a winding axis of the coil conductor, first and second side surfaces facing each other, and third and fourth side surfaces facing each other. An average particle diameter of each of metal magnetic particles constituting the upper surface, metal magnetic particles constituting the lower surface, metal magnetic particles constituting the first side surface, and metal magnetic particles constituting the second side surface is smaller than an average particle diameter of metal magnetic particles existing inside a winding portion of the coil conductor.

A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

Embodiments of the disclosure provide an integrated circuit (IC) structure. The IC structure may include a first metal layer on a substrate, and a second metal layer on the substrate that is horizontally separated from the first metal layer. A dielectric material may include a first portion on the first metal layer, and having a first upper surface, a second portion on the second metal layer, and having a second upper surface, and a third portion on the substrate between the first metal layer and the second metal layer. The third portion of the dielectric material includes a third upper surface above the first upper surface of the first portion and the second upper surface of the second portion of the dielectric material.

A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.