A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).

An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.

An inductor component includes a main body formed in a flat-plate shape and including a magnetic layer; an inductor wiring line disposed on a plane inside the main body; a first vertical wiring line that extends, from a pad portion which is an end portion of the inductor wiring line, in a first direction to pass through the inside of the main body, and is exposed on a first principal surface side of the main body; a second vertical wiring line that extends, from the pad portion of the inductor wiring line, in a second direction to pass through the inside of the main body, and is exposed on a second principal surface side of the main body; and an insulation layer of a non-magnetic body. The first vertical wiring line includes a via conductor and a columnar wiring line. The second vertical wiring line includes a columnar wiring line.

New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.

An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

Described is a high Q-factor inductor. The inductor is formed as a unit cell coil, which is copied twice for a dual-coil inductor and copied four times for a quad-coil inductor. For each copy of the unit cell coil, the coil is rotated a subsequent substantially 90 degrees or substantially −90 degrees. The rotation enables the terminals of the inductor to be routed equal-distant to a circuit that is placed in the line of symmetry between the two coils.

An inductor and a method of making an inductor. The inductor includes a stack of dielectric layers. The inductor also includes a plurality of metal levels comprising patterned metallic features of the inductor. Each metal level is located at an interface between adjacent dielectric layers in the stack. The patterned metallic features include a first plurality of inductor windings arranged in a substantially flat spiral in one of the metal levels. The patterned metallic features also include a second plurality of inductor windings in which each winding is located in a respective one of the plurality of metal levels. The first plurality of windings is connected in series with the second plurality of windings.

A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.