A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

A method and apparatus are described for fabricating a microchip structure (60A) which includes a first chip (41) that is affixed to a lead frame strip (11-18) having a plurality of lead frame pads (11-16) in a circuit mounting area (19) and a planar lead frame inductor coil (17) that is laterally displaced from the circuit mounting area (19), where molded body (61) encapsulates the first chip (41), lead frame pads (11-16) and planar lead frame inductor coil (17).

A method and apparatus are described for fabricating a microchip structure (60A) which includes a first chip (41) that is affixed to a lead frame strip (11-18) having a plurality of lead frame pads (11-16) in a circuit mounting area (19) and a planar lead frame inductor coil (17) that is laterally displaced from the circuit mounting area (19), where molded body (61) encapsulates the first chip (41), lead frame pads (11-16) and planar lead frame inductor coil (17).

An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

The inductor component includes: coil portion around which lead wire is wound; lead-out portion at which an end portion of the lead wire is led out; connection line portion to which the lead-out portion is connected; outer terminal portion integrally formed with the connection line portion; and mold body which contains a magnetic material and in which the coil portion and the connection line portion are embedded. The connection line portion has a shape elongating along the lead-out portion, and includes a pair of first bonding pieces between the coil portion and terminal of the lead-out portion, the pair of first bonding pieces elongating from both sides of the connection line portion in mutually opposite directions. The pair of first bonding pieces has distal end sides each folded toward a part of the lead-out portion on the opposite side from the connection line portion.

A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.