Patent classifications
H01F41/183
Boron-Based and High-Entropy Magnetic Materials
A method of fabricating high magnetic anisotropy materials using a metallic high entropy alloy is described in this disclosure. Targets of metals or targets of alloys comprising at least one elemental ferromagnetic material are used in a sputtering tool to deposit on a substrate thin films of high entropy alloys. The sputtering targets may be elemental targets or they may comprise multiple metals. In addition, targets of materials such as boron, platinum, or aluminum may be included in the sputtering process to enhance magnetic properties of the resultant thin films. The sputtering may take place by co-sputtering multiple targets simultaneously or by alternatively sputtering layers from the targets. After sputtering the materials are heated through a rapid thermal annealing process to a high temperature, which facilitates the formation of the desired crystalline phases which exhibit high magnetocrystalline anisotropy.