A method of aligning microwires includes modifying the microwires so they are more responsive to a magnetic field. The method also includes using a magnetic field so as to magnetically align the microwires. The method can further include capturing the microwires in a solid support structure that retains the longitudinal alignment of the microwires when the magnetic field is not applied to the microwires.

The invention discloses an NdFeB permanent magnet with high coercivity and high resistivity and a method for preparing the same. The method comprises the steps of: spraying powdery slurry containing heavy rare earth compounds, oxides and/or carbides on a flaky NdFeB permanent magnets blank after it is subjected to surface cleaning process; then stacking magnets on top of each other, and performing three-stage heat treatment on the stacked magnets to obtain the NdFeB permanent magnet with high coercivity and high resistivity. Heavy rare earth penetrates into interior of the flaky magnets at a high temperature, so that coercivity of the flaky magnets is improved. However, part of the heavy rare earth elements or alloy elements and carbide powder or oxide powder, which are not penetrated into the flaky magnets, form an interlayer bonding two of flaky magnets together.

An inductor and a method for manufacturing the same are provided. The inductor includes at least two inductor structures. Each of the at least two inductor structures includes a single coil, a magnetic body, an electrode structure, and a protection structure. The single coil has a first end and a second end. The single coil is encapsulated by the magnetic body. The first end and the second end are exposed from a bottom surface of the magnetic body. The electrode structure is disposed on the bottom surface of the magnetic body. The electrode structure includes a first electrode and a second electrode that are spaced apart from each other. The first electrode is electrically connected with the first end. The second electrode is electrically connected with the second end. The first electrode and the second electrode are separated by the protection structure.

An inductor and a method for manufacturing the same are provided. The inductor includes at least two inductor structures. Each of the at least two inductor structures includes a single coil, a magnetic body, an electrode structure, and a protection structure. The single coil has a first end and a second end. The single coil is encapsulated by the magnetic body. The first end and the second end are exposed from a bottom surface of the magnetic body. The electrode structure is disposed on the bottom surface of the magnetic body. The electrode structure includes a first electrode and a second electrode that are spaced apart from each other. The first electrode is electrically connected with the first end. The second electrode is electrically connected with the second end. The first electrode and the second electrode are separated by the protection structure.

An inductor and a manufacturing method thereof. The inductor includes a coil, a magnetic base, and a magnetic covering layer, where the coil includes a conductor and an isolation layer coated on a surface of the conductor, the magnetic base is configured to fix the coil, the magnetic covering layer covers the coil located on the magnetic base, and an equivalent particle size of metal particles in the magnetic covering layer is less than or equal to twice the thickness of the isolation layer. In the present disclosure, the magnetic covering layer of the inductor is made of a soft magnetic metal material, and the equivalent particle size of the metal particles in the soft magnetic metal material is less than or equal to twice the thickness of the isolation layer of the coil, such that a short circuit percentage caused by powder piercing the coil can be reduced.

An inductor and a manufacturing method thereof. The inductor includes a coil, a magnetic base, and a magnetic covering layer, where the coil includes a conductor and an isolation layer coated on a surface of the conductor, the magnetic base is configured to fix the coil, the magnetic covering layer covers the coil located on the magnetic base, and an equivalent particle size of metal particles in the magnetic covering layer is less than or equal to twice the thickness of the isolation layer. In the present disclosure, the magnetic covering layer of the inductor is made of a soft magnetic metal material, and the equivalent particle size of the metal particles in the soft magnetic metal material is less than or equal to twice the thickness of the isolation layer of the coil, such that a short circuit percentage caused by powder piercing the coil can be reduced.

A system for fabricating anisotropic magnetic nanowire composites includes a chamber for containing an ionic fluid. A hole in a wall of the chamber allows for the ionic fluid to be in contact with a porous template outside of the chamber, and a cathode and an anode provide an electric field across the ionic fluid and porous template. The electric field causes ionic materials in the ionic fluid to migrate into the pores of the porous template, therefore plating nanowires in the porous template. Constant distances and positions of the anode, cathode, a reference probe, and a stirring element allow for the fabrication of longer, more uniform nanowires, and for the generation of consistent magnetic nanowire composites across multiple fabrication sessions.

Methods and systems for producing iron from an iron-containing ore and removing impurities found in the iron-containing ore are disclosed. For example, a method for producing iron comprises providing a feedstock having an iron-containing ore and one or more impurities to a dissolution subsystem comprising a first electrochemical cell; producing an iron-rich solution, in the dissolution subsystem; treating the iron-rich solution to remove at least a portion of one or more impurities by raising a pH of the iron-rich solution from an initial pH to an adjusted pH thereby precipitating at least a portion of the one or more impurities in the treated iron-rich solution; delivering the treated iron-rich solution to an iron-plating subsystem having a second electrochemical cell; second electrochemically reducing at least a first portion of the transferred formed Fe.sup.2+ ions to Fe metal; and removing the Fe metal from the second electrochemical cell thereby producing iron.

An embedding method and embedded structure for a magnetic transformer, an electronic device and a storage medium are disclosed. The method includes: providing a copper-clad substrate; electroplating on surfaces of the copper-clad substrate to form a coil; laminating prepregs and copper sheets to form a first substrate; drilling the first substrate to define a first and second through hole; filling a magnetic material in the first through holes to form first embedded magnets; forming a metal layer on an inner wall of the second through hole and surfaces of the first substrate; manufacturing conductive pillars and sacrificial blocks; laminating insulating layers; etching the sacrificial block to define cavities; filling a magnetic material in the cavities to form second embedded magnets; and manufacturing a circuit and a solder resist layer on surfaces of the insulating layer to form a package substrate.

An embedding method and embedded structure for a magnetic transformer, an electronic device and a storage medium are disclosed. The method includes: providing a copper-clad substrate; electroplating on surfaces of the copper-clad substrate to form a coil; laminating prepregs and copper sheets to form a first substrate; drilling the first substrate to define a first and second through hole; filling a magnetic material in the first through holes to form first embedded magnets; forming a metal layer on an inner wall of the second through hole and surfaces of the first substrate; manufacturing conductive pillars and sacrificial blocks; laminating insulating layers; etching the sacrificial block to define cavities; filling a magnetic material in the cavities to form second embedded magnets; and manufacturing a circuit and a solder resist layer on surfaces of the insulating layer to form a package substrate.