A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A capacitor array that includes a plurality of solid electrolytic capacitor elements, a sheet-shaped first sealing layer, and a sheet-shaped second sealing layer. The plurality of solid electrolytic capacitor elements include an anode plate, a porous layer, a dielectric layer, and a cathode layer. Each of the solid electrolytic capacitor elements are partitioned from each other by a slit-shaped removal part and have a first main surface and a second main surface.

A capacitor array that includes a plurality of solid electrolytic capacitor elements, a sheet-shaped first sealing layer, and a sheet-shaped second sealing layer. The plurality of solid electrolytic capacitor elements include an anode plate, a porous layer, a dielectric layer, and a cathode layer. Each of the solid electrolytic capacitor elements are partitioned from each other by a slit-shaped removal part and have a first main surface and a second main surface.

This invention concerns a power module comprising a power device, a baseplate, circuit carrier, and a flat stacked aluminium electrolytic snubber capacitor comprising a layered structure of a cathode layer, a separator layer, comprising paper and an electrolyte and an anode layer, comprising an aluminium material with an aluminium oxide dielectric, wherein the circuit carrier are mounted on the baseplate, the power device and snubber capacitor are placed on the circuit carrier within the power module and electrically connected to the circuit carrier, the circuit carrier being configured for providing an electrical connection between the power device and the snubber capacitor.

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

An electrolytic capacitor includes a capacitor element. The capacitor element includes an anode part, a cathode part, and an intermediate part. The anode part includes a first portion that is a part of an anode body having a porous region, and a first dielectric layer. The intermediate part includes a second portion of the anode body, a second dielectric layer, and a first insulating member containing a first resin component. The cathode part includes a third portion of the anode body, a third dielectric layer, a solid electrolyte layer covering at least a part of the third dielectric layer, and a cathode lead-out layer covering at least a part of the solid electrolyte layer. The first resin component contains a curing product of a first reactive compound. At least a part of the first insulating member is disposed in pores of the porous region in the intermediate part.

An electrolytic capacitor includes a capacitor element. The capacitor element includes a separator, an anode body and a cathode body each having a foil shape and facing each other with the separator disposed between the anode body and the cathode body, and an electrolyte layer being in contact with the anode body, the cathode body, and the separator. The electrolyte layer contains a first conductive polymer and a first compound having a melting point of 50° C. or higher. The first compound is at least one compound selected from the group consisting of a sugar and a polyhydric alcohol. The first compound is unevenly distributed in the electrolyte layer.