Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.

Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.

Provided herein is a capacitor and method of forming a capacitor. The capacitor comprises an anode with an anode wire extending from the anode. A dielectric is on the anode and a conductive polymer is on the dielectric. The anode comprises at least one face comprising a surface area wherein at least 60% of the surface area is a land and no more than 40% of the surface area comprises perturbations.

An electrolytic capacitor includes a capacitor element having: an anode; a dielectric layer covering at least a part of the anode body; a solid electrolyte layer covering at least a part of the dielectric layer; and a cathode lead-out layer covering at least a part of the solid electrolyte layer. The cathode lead-out layer includes a carbon layer covering at least a part of the solid electrolyte layer, a first metal layer covering at least a part of the carbon layer, and a second metal layer covering at least a part of the first metal layer. The first metal layer contains first metal particle, and the second metal layer contains second metal particles and a second binder resin. The first metal layer contains no binder resin, or contains a first binder resin in a volume ratio smaller than a volume ratio of the second binder resin contained in the second metal layer.

A capacitor array that includes a solid electrolytic capacitor element including an anode plate made of a valve-action metal, a porous layer on at least one main surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer including a solid electrolyte layer on a surface of the dielectric layer; a first anodic through-electrode electrically connected to the anode plate; a second anodic through-electrode electrically connected to the anode plate; and a first cathodic through-electrode electrically connected to the cathode layer, wherein a distance between the first cathodic through-electrode and the first anodic through-electrode is the same or substantially the same as a distance between the first cathodic through-electrode and the second anodic through-electrode in a plane view from a thickness direction of the anode plate.

A capacitor array that includes a solid electrolytic capacitor element including an anode plate made of a valve-action metal, a porous layer on at least one main surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer including a solid electrolyte layer on a surface of the dielectric layer; a first anodic through-electrode electrically connected to the anode plate; a second anodic through-electrode electrically connected to the anode plate; and a first cathodic through-electrode electrically connected to the cathode layer, wherein a distance between the first cathodic through-electrode and the first anodic through-electrode is the same or substantially the same as a distance between the first cathodic through-electrode and the second anodic through-electrode in a plane view from a thickness direction of the anode plate.

A solid electrolytic capacitor includes a capacitor element having an anode body that is a porous sintered body having a hexahedral shape, an anode lead, a dielectric layer, and a solid electrolyte layer. One end of the anode lead is embedded into the anode body from a first surface of the anode body. The anode body includes a second surface and a third surface which are opposite to each other. The anode body has a first region including the second surface, a second region including the third surface, and a third region interposed between the first region and the second region. The third region has lower density than each of the first region and the second region. An average thickness T3 of the third region and a thickness TL of the anode lead satisfy a relationship T3<TL. A surface of the anode lead is in contact with at least one of the first region and the second region.

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.