A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

An electrode element (1) for an energy storage unit (200), such as a capacitor, has an electrode body (100) made of an active electrode material (E), wherein the electrode body (100) includes one or more of: at least one cavity (110) on its surface or in its interior; at least one partial volume (120) of lower density; and/or a surface coating (D) covering at least a portion of the surface of the electrode body (100), such that the surface area covered by the surface coating (D) remains unwetted when in contact with an electrolyte. Energy storage units (200) incorporating the electrode element (1) are particularly suitable for use in implantable electrotherapeutic devices.

An electrode element (1) for an energy storage unit (200), such as a capacitor, has an electrode body (100) made of an active electrode material (E), wherein the electrode body (100) includes one or more of: at least one cavity (110) on its surface or in its interior; at least one partial volume (120) of lower density; and/or a surface coating (D) covering at least a portion of the surface of the electrode body (100), such that the surface area covered by the surface coating (D) remains unwetted when in contact with an electrolyte. Energy storage units (200) incorporating the electrode element (1) are particularly suitable for use in implantable electrotherapeutic devices.

Provided is a composite electrode material. The composite electrode material is disposed on a surface of an electrode. The composite electrode material includes a plurality of conductive material layers and a plurality of active material layers. The conductive material layers and the active material layers are alternately stacked along a direction non-parallel to the surface of the electrode, and are arranged disorderly along a direction parallel to the surface of the electrode.

An electrolytic capacitor includes a capacitor element and electrolytic solution. The capacitor element includes an anode body with an oxide film, and a solid electrolyte contacting the oxide film. The electrolytic solution contains a solvent and a solute. The solvent contains at least one selected from the group consisting of a lactone compound, a glycol compound, and a sulfone compound. The solute includes a first acid component and a base component. The first acid component includes at least one of a benzenedicarboxylic acid and a derivative of the benzenedicarboxylic acid. The base component includes at least one of an amine and an amidine. A concentration of the solute in the electrolytic solution ranges from 15% by mass to 40% by mass, inclusive. A ratio (V/Vw) of a formation voltage V of the oxide film to a rated voltage Vw of the electrolytic capacitor is less than or equal to 1.7.

The present invention provides a method for manufacturing a graphene composite electrode material, including the following steps: (1) providing a glass substrate, the glass substrate having a melting point greater than 1100° C.; (2) washing the glass substrate and then forming a metal film on the glass substrate; (3) patterning the metal film to form a circuit pattern; and (4) forming a graphene film on the circuit pattern so as to form a graphene composite electrode material. The method for manufacturing a graphene composite electrode material according to the present invention uses a temperature resistant glass substrate and a metal catalyst to directly grow a graphene film on a circuit pattern thereby requiring no transfer, not affected by solvent applied in transfer, having relatively high quality of film formation, requiring no etching, allowing for direct formation of a graphene composite electrode material, having a simple process, providing an effect of protection of the metal circuit pattern due to stable chemical property of graphene, and thus effectively extending the service life of the graphene composite electrode material.

An electrode structure and preparation methods thereof, the electrode structure includes a substrate and a sintered body, wherein the sintered body is formed on the surface of the substrate, and the sintered body is provided with cracks that are formed after the hydration treatment of the sintered body. The continuity of cracks of the electrode structure was good, and the preparation method is suitable for industrial production. The electrode structure with cracks can effectively increase the bending strength and reduce the stress during the winding process of the electrode structure, thereby reducing the risk of fracture during the application process. It can also improve the flexural strength of the electrode structure while maintaining the original high electrostatic capacity and lower leakage current value of the electrode structure, without negatively affecting the performance of the electrode structure.

A capacitor electrode includes a conductive base member and an electrode part electrically connected to the base member. The electrode part contains carbon particles of a first carbon material capable of adsorbing and desorbing ions. The electrode part further contains voids including first voids with diameters of not less than 0.2 μm and not more than 1.0 μm, and second voids with diameters of not less than 0.05 μm and less than 0.2 μm. The value of (V.sub.A×V.sub.A)/(V.sub.B×M) is greater than 0.022, where V.sub.A is the sum of the volumes of the first voids, V.sub.B is the sum of the volumes of the second voids, and M is the volume of the electrode part per unit weight of the electrode part.