H01G9/042

Anodes containing spherical powder and capacitors

Anodes made from powder, such as tantalum powder, that is highly spherical is described. Methods to make the anodes are further described.

Anodes containing spherical powder and capacitors

Anodes made from powder, such as tantalum powder, that is highly spherical is described. Methods to make the anodes are further described.

CHIP-STYLE CONDUCTIVE POLYMER CAPACITOR AND METHOD FOR PACKAGING THE SAME

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

CATHODE AND ELECTROLYTIC CAPACITOR

A cathode and an electrolytic capacitor including the cathode which can suppress production of hydrogen gas are provided. The cathode of the electrolytic capacitor comprising cathode foil formed of valve action metal, and a conductive layer formed on a surface of the cathode foil. When current in a range of current density of leakage current of the electrolytic capacitor flows by electrochemical polarization, potential corresponding to said current is at a higher side than a natural immersion potential of reference cathode foil formed of the valve action metal with purity of 99.9%.

Semiconductor devices and method of manufacturing the same

A method of manufacturing a semiconductor device includes forming a preliminary lower electrode layer on a substrate, the preliminary lower electrode layer including a niobium oxide; converting at least a portion of the preliminary lower electrode layer to a first lower electrode layer comprising a niobium nitride by performing a nitridation process on the preliminary lower electrode layer; forming a dielectric layer on the first lower electrode layer; and forming an upper electrode on the dielectric layer.

CAPACITOR WITH CONDUCTIVE ADHESION LAYER

The present invention relates to a capacitor having a metal current collector, a conductive adhesion layer applied on the metal current collector, and an electrode active layer applied on the conductive adhesion layer, wherein the adhesion layer comprises a conductive non-carbide metal compound, particularly a metal oxide or metal nitride. The present invention further relates to a method of manufacture thereof as well a medical device comprising such capacitor.

SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME

Provided is a solid electrolytic capacitor having large capacitance, low ESR, and superior high-frequency characteristics and high-temperature endurance. The solid electrolytic capacitor is provided with: a cathode 10 having a cathode substrate 11 made of a valve metal and having an etching pit 11a; an oxide layer 12 made of an oxide of the valve metal provided on a surface of the cathode substrate 11, and a carbon coating layer 13 provided on a surface of the oxide layer 12, the carbon coating layer 13 including carbon particles and having an entry area 13a that enters the etching pit 11a and a penetration area 13b that penetrates through the oxide layer 12 and conducts with the cathode substrate 11; an anode having an anode substrate made of a valve metal, and a dielectric layer provided on a surface of the anode substrate and made of an oxide of the valve metal that composes the anode substrate; and a solid electrolyte layer including a conductive polymer provided between the carbon coating layer of the cathode and the dielectric layer of the anode.

Thermoelectric electrochemical conversion devices
11488776 · 2022-11-01 ·

A heat capacitor with simple structure, easy to manufacture and high thermoelectric conversion efficiency is provided. The heat capacitor includes: a pair of electrodes, at least one said electrode being a carbonaceous electrode; and a thermoelectric electrolyte disposed between the pair of electrodes, wherein the distance between the pair of electrodes is at most 1 mm.

Thermoelectric electrochemical conversion devices
11488776 · 2022-11-01 ·

A heat capacitor with simple structure, easy to manufacture and high thermoelectric conversion efficiency is provided. The heat capacitor includes: a pair of electrodes, at least one said electrode being a carbonaceous electrode; and a thermoelectric electrolyte disposed between the pair of electrodes, wherein the distance between the pair of electrodes is at most 1 mm.

Electrolytic capacitor and process for forming an electrolytic capacitor

The invention is related to an improved capacitor and an improved process for forming a capacitor. The process comprises forming an anode comprising a dielectric on the anode. A cathode layer is then formed on the dielectric wherein the cathode layer comprises a self-doped conductive polymer and a cross-linker wherein a weight ratio of crosslinker to self-doped conductive polymer is at least 0.01 to no more than 2.