Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, an alloy layer disposed on the first major surface of a substrate, and tantalum material disposed on the alloy layer such that the alloy layer is between the tantalum material and the first major surface of the substrate. The tantalum material includes bonded tantalum particles. The electrical component can also include a dielectric layer disposed on the tantalum particles, a cathode electrode disposed over the tantalum material, and an anode electrode disposed on the second major surface of the substrate.

A multicomponent conductive adhesive barrier includes an adhesive layer and a conductive barrier. The adhesive layer includes a doped pressure-sensitive adhesive and the conductive barrier layer is a carbon or metal-based material. A photoelectrode structure includes a substrate, a photoabsorbing layer, a multicomponent conductive adhesive barrier, and an electrocatalyst. A method for fabricating the photoelectrode structure includes applying a photoabsorbing layer to a substrate, preparing an adhesive layer, and forming a multicomponent conductive adhesive barrier by applying a conductive barrier layer to the adhesive layer.

A multicomponent conductive adhesive barrier includes an adhesive layer and a conductive barrier. The adhesive layer includes a doped pressure-sensitive adhesive and the conductive barrier layer is a carbon or metal-based material. A photoelectrode structure includes a substrate, a photoabsorbing layer, a multicomponent conductive adhesive barrier, and an electrocatalyst. A method for fabricating the photoelectrode structure includes applying a photoabsorbing layer to a substrate, preparing an adhesive layer, and forming a multicomponent conductive adhesive barrier by applying a conductive barrier layer to the adhesive layer.

A capacitor array that includes a plurality of solid electrolytic capacitor elements each of which has a first main surface and a second main surface facing each other in a thickness direction and includes an anode plate made of a valve action metal, a porous layer on at least one surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer on a surface of the dielectric layer and including a solid electrolyte layer; a first sealing layer in a sheet-like shape and covering the first main surface of the plurality of solid electrolytic capacitor elements; and a second sealing layer in a sheet-like shape and covering the second main surface of the plurality of solid electrolytic capacitor elements.

When manufacturing an electrode for an electrolytic capacitor, in a first hydration step (ST1), an aluminum electrode is immersed in a first hydration processing solution having a temperature of at least 70° C. and comprising pure water or an aqueous solution to which phosphoric acid or a phosphate has been added so that the phosphorus concentration is no greater than 4 mass ppm. In a second hydration step (ST2), the aluminum electrode is immersed in a second hydration processing solution to which phosphoric acid or a phosphate has been added so that the phosphorus concentration is 4-5000 mass ppm, the second hydration processing solution having a pH of 3.0-9.0 and a temperature of at least 70° C. In a chemical conversion step (ST3), at least a boric acid chemical conversion process in which the aluminum electrode is chemically converted in a boric acid-based chemical conversion solution is included, and a chemical conversion coating having a coating withstand voltage of at least 200 V is formed on the aluminum electrode.

When manufacturing an electrode for an electrolytic capacitor, in a first hydration step (ST1), an aluminum electrode is immersed in a first hydration processing solution having a temperature of at least 70° C. and comprising pure water or an aqueous solution to which phosphoric acid or a phosphate has been added so that the phosphorus concentration is no greater than 4 mass ppm. In a second hydration step (ST2), the aluminum electrode is immersed in a second hydration processing solution to which phosphoric acid or a phosphate has been added so that the phosphorus concentration is 4-5000 mass ppm, the second hydration processing solution having a pH of 3.0-9.0 and a temperature of at least 70° C. In a chemical conversion step (ST3), at least a boric acid chemical conversion process in which the aluminum electrode is chemically converted in a boric acid-based chemical conversion solution is included, and a chemical conversion coating having a coating withstand voltage of at least 200 V is formed on the aluminum electrode.

A semiconductor photoelectrode that is to be located in an aqueous solution to cause a decomposition reaction of the aqueous solution upon being irradiated with light, the semiconductor photoelectrode including: a semiconductor layer that is formed on an insulative or conductive substrate and is provided with a plurality of protrusion structures that protrude in one direction that is opposite a direction in which the substrate is located; a catalyst layer that is continuously laminated on the surface of the semiconductor layer; and a wire that is electrically connected to the semiconductor layer.

A semiconductor photoelectrode that is to be located in an aqueous solution to cause a decomposition reaction of the aqueous solution upon being irradiated with light, the semiconductor photoelectrode including: a semiconductor layer that is formed on an insulative or conductive substrate and is provided with a plurality of protrusion structures that protrude in one direction that is opposite a direction in which the substrate is located; a catalyst layer that is continuously laminated on the surface of the semiconductor layer; and a wire that is electrically connected to the semiconductor layer.

A wet tantalum electrolytic capacitor containing a cathode, fluidic working electrolyte, and anode formed from an anodically oxidized sintered porous tantalum pellet is described. The pellet is formed from a pressed tantalum powder. The tantalum powder is formed by reacting a tantalum oxide compound, for example, tantalum pentoxide, with a reducing agent that contains a metal having an oxidation state of 2 or more, for example, magnesium. The resulting tantalum powder is nodular or angular and has a specific charge that ranges from about 9,000 μF*V/g to about 11,000 μF*V/g. Using this powder, wet tantalum electrolytic capacitors have breakdown voltages that ranges from about 340 volts to about 450 volts. This makes the electrolytic capacitors ideal for use in an implantable medical device.

An electrolytic capacitor includes an anode body including a dielectric layer, a cathode body, and a conductive polymer layer and a liquid component that are disposed between the anode body and the cathode body. The cathode body includes a base material part having an outer surface that is roughened surface and has a pore opened at the outer surface, and an inorganic conductive layer covering at least a part of the outer surface. The base material part includes a first coating layer disposed along at least a part of inner wall of the pore. The first coating layer contains phosphorus.