The present invention relates to a glass material for sealing a large-area dye-sensitized solar cell and, more specifically, to a glass material which does not react with an electrolyte and allows uniform and high-strength binding even on a large area. According to the present invention, the glass material is expected to produce action effects of improving reliability and lifetime of solar cell products since it can uniformly seal a dye-sensitized solar cell, is chemically stable due to the absence of the reaction with an electrolyte, and has physical strength appropriate for large-area binding.

A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees.

A sensitive device is described including an edge of the sensitive device and a composite material sealing the edge of the sensitive device. The composite material includes a homogeneous dispersion of superficially functionalized nanozeolites in a polymerizable compound. The nanozeolites contain surface modifying organic groups belonging to the same chemical class of at least one functional group of the polymerizable compound.

A photoelectric conversion element including: a substrate; a plurality of conductive layers provided on the substrate and arranged with grooves interposed therebetween; and at least one photoelectric conversion cell. The photoelectric conversion cell includes: one conductive layer of the plurality of conductive layers; a counter substrate facing the conductive layer; and an oxide semiconductor layer provided between the conductive layer and the counter substrate. A conductive film is provided on the substrate along a longitudinal direction of the grooves between the plurality of conductive layers, and cracks having a length of 5 m or more exist in the conductive film at a ratio of 15 or more per 100 m in length along the longitudinal direction of the grooves.

A dye-sensitized solar cell comprises a pair of electrodes that face each other; an electrolyte that is disposed between the pair of electrodes; and a sealing section that connects the pair of electrodes and is provided around the electrolyte. In the dye-sensitized solar cell, the sealing section comprises at least one corner section when the sealing section is viewed in planar view from the electrode side, and a first contact surface at the corner section with at least one of the pair of electrodes comprises a first curve line-containing surface containing a curved curve line on the electrolyte side.

Disclosed herein are perovskite based optoelectronic devices made entirely via solution-processing at low temperatures (<150? C.) which provide for simple manufacturing, compatibility with flexible substrates, and perovskite-based tandem devices. These perovskite based optoelectronic devices are produced using an electron transport layer on which the perovskite layer is formed which is passivated using a ligand selected to reduce electron-hole recombination at the interface between the electron transport layer and the perovskite layer.

A method of synthesizing a mixed-halide perovskite is disclosed herein. The method includes the steps of mixing a first single-halide perovskite and a second single-halide perovskite to form a solid phase mixture and heating the solid phase mixture at a temperature below a first decomposition temperature of the first single-halide perovskite and below a second decomposition temperature of the second single-halide perovskite for a time sufficient to form the mixed-halide perovskite. During the mixing, the first and second single-halide perovskite are both in the solid phase. A mixed-halide perovskite made according to the method is also disclosed herein. The mixed-halide perovskite is free of amorphous and/or semicrystalline phases. The mixed-halide perovskite can be utilized in a photovoltaic cell in a solar panel.

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
V.sub.2O.sub.5+TeO.sub.2+Fe.sub.2O.sub.3+P.sub.2O.sub.5?90 (mass %)(1)
V.sub.2O.sub.5>TeO.sub.2>Fe.sub.2O.sub.3>P.sub.2O.sub.5 (mass %)(2)

A dye-sensitized photoelectric conversion element including a cell is disclosed. The cell includes a conductive substrate and a transparent conductive layer, a counter substrate facing the conductive substrate and including a metal substrate, a semiconductor layer provided on the conductive substrate, a sealing portion bonding the conductive and the counter substrates, a connecting portion connecting one end of a wiring material and the metal substrate, and a portion to be connected which is connected to the other end of the wiring material, the connecting portion contains first conductive particles, a filler, and a binder resin, the wiring material contains second conductive particles and a binder resin, an average particle diameter of the first conductive particles is greater than that of the filler in the connecting portion, and a content rate of the filler in the connecting portion is greater than that of the filler in the wiring material.

The present invention is an electronic device comprising a first substrate, a second substrate arranged opposite the first substrate, a sealed portion arranged between the first substrate and the second substrate, and a sealing portion that connects the first and the second substrate and is provided around the sealed portion, wherein at least a portion of the sealing portion following along the periphery of the sealed portion has outer resin sealing portions respectively fixed to the first substrate and the second substrate and an intermediate resin sealing portion arranged so as to be interposed by the outer resin sealing portions between the first substrate and the second substrate, the outer resin sealing portions and the intermediate resin sealing portion contain resin, and a melt flow rate or melting point of the intermediate resin sealing portion differs from a melt flow rate or melting point of the outer resin sealing portions.