Patent classifications
H01H1/023
CONTACT MATERIAL FOR MEMS DEVICES
The present application discloses a method for forming electrical contacts on a semiconductor substrate. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment.
Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
SILVER METAL OXIDE ALLOY AND METHOD OF MAKING
Various embodiments disclosed relate to an alloy. The alloy includes elemental silver. The alloy further includes a metal oxide phase in the elemental silver. The metal oxide phase includes a wetting agent layer that coats the metal oxide phase.
Electrical contact tip for switching applications and an electrical switching device
An electrical contact tip for switching applications. The contact tip includes a body having a first layer and a second layer. The first layer arranged on the second layer and adapted to come in contact with a corresponding contact tip during switching operations. The first and second layers consist of Ag-composites of one or more elements, compounds or alloys, where the hardness of the first layer is lower than the hardness of the second layer.
Limit switch
A limit switch includes fixed contacts and a movable contact, the fixed contacts and the movable contact formed from an AuNi metal alloy of no less than 97% Au by weight. The limit switch detects position, change, movement, number of passes, or the like and outputs an on signal or an off signal depending on whether a detection occurred.
Limit switch
A limit switch includes fixed contacts and a movable contact, the fixed contacts and the movable contact formed from an AuNi metal alloy of no less than 97% Au by weight. The limit switch detects position, change, movement, number of passes, or the like and outputs an on signal or an off signal depending on whether a detection occurred.
Contact unit for an electromechanical switching device
A contact unit for an electromechanical switching device includes a carrier element and a contact element connected to the carrier element. The contact element has a silver-containing layer that provides a contact area for making releasable contact with a further contact area of the switching device depending on a switching state of the switching device. The silver-containing layer includes diamond particles at least in the region of the contact area.
Contact unit for an electromechanical switching device
A contact unit for an electromechanical switching device includes a carrier element and a contact element connected to the carrier element. The contact element has a silver-containing layer that provides a contact area for making releasable contact with a further contact area of the switching device depending on a switching state of the switching device. The silver-containing layer includes diamond particles at least in the region of the contact area.
Circuit breakers with moving contact having heel-toe action
Circuit breakers with moving contacts having heel-toe action are configured to direct arcing across a small portion of a stationary contact surface to an adjacent arc chute to thereby alleviate deterioration due to arcing and improve conductivity of a major portion of the stationary contact and moving contact surface over time.