A switch device includes a housing including a recessed portion, a metal member, and a movable contact point member. The recessed portion is recessed in a thickness direction from an opening formed in a first surface. The metal member includes a terminal protruding from the housing, a fixed contact point exposed to an inner side of the recessed portion, and a connection portion connecting the terminal and the fixed contact point. The movable contact point member is provided in the recessed portion and is configured to move to connect to or disconnect from the fixed contact point. A sealing unit is provided in a gap between the connection portion and the housing. The sealing unit is made by solidifying a sealing agent supplied through a hole portion that is in communication with the connection portion from a second surface opposite to the first surface of the housing.

A backlight module is provided. The backlight module includes a backlight control circuit and a plurality of multiple light-emitting elements coupled in series and coupled to the backlight control circuit. The backlight control circuit transmits a packet. Each of the light-emitting elements compares an address of the packet with an individual address of each of the light-emitting elements. When the address of the packet matches the individual address of a target light-emitting element of the light-emitting elements, the target light-emitting element emits light according to a light-emitting data of the packet. Each of the light-emitting elements transmits the packet to a next light-emitting element.

A backlight module is provided. The backlight module includes a backlight control circuit and a plurality of multiple light-emitting elements coupled in series and coupled to the backlight control circuit. The backlight control circuit transmits a packet. Each of the light-emitting elements compares an address of the packet with an individual address of each of the light-emitting elements. When the address of the packet matches the individual address of a target light-emitting element of the light-emitting elements, the target light-emitting element emits light according to a light-emitting data of the packet. Each of the light-emitting elements transmits the packet to a next light-emitting element.

A keyboard device with a protecting function and a manufacturing method of the keyboard device are provided. Firstly, a mold is provided. Then, a frame material is placed into the mold to form a frame body, and a film material is placed into the mold to form a protective film. Consequently, the protective film is fixed on the frame body. After the mold is removed, a keyboard module is assembled with the frame body. Consequently, the keyboard device is manufactured. The protective film includes a sheet-like portion, plural connection portions and plural covering portions. The frame body includes plural spacer structures and plural perforations. The sheet-like portion is fixed on the plural spacer structures. The keyboard module includes a base plate and plural keys. The keycap is penetrated through the corresponding perforation and contacted with the corresponding covering portion.

A keyboard device with a protecting function and a manufacturing method of the keyboard device are provided. Firstly, a mold is provided. Then, a frame material is placed into the mold to form a frame body, and a film material is placed into the mold to form a protective film. Consequently, the protective film is fixed on the frame body. After the mold is removed, a keyboard module is assembled with the frame body. Consequently, the keyboard device is manufactured. The protective film includes a sheet-like portion, plural connection portions and plural covering portions. The frame body includes plural spacer structures and plural perforations. The sheet-like portion is fixed on the plural spacer structures. The keyboard module includes a base plate and plural keys. The keycap is penetrated through the corresponding perforation and contacted with the corresponding covering portion.

An electronic device is provided. The electronic device includes a housing including an outer surface configured to at least partially form an external appearance of the electronic device, a button accommodation recess having a predetermined depth from the outer surface in a first direction oriented to the inner space of the electronic device, and at least one through-hole connected to the inner surface of the housing in the button accommodation recess, a key button disposed through the button accommodation recess, and including a key top inserted into the button accommodation recess and at least partially exposed to the outside, and a key base coupled to the key top, and including a protrusion facing a key flexible printed circuit board (FPCB) disposed in the inner space through the at least one through-hole. The protrusion may include an engagement portion formed at an end thereof to be larger than the protrusion.

An electronic device is provided. The electronic device includes a housing including an outer surface configured to at least partially form an external appearance of the electronic device, a button accommodation recess having a predetermined depth from the outer surface in a first direction oriented to the inner space of the electronic device, and at least one through-hole connected to the inner surface of the housing in the button accommodation recess, a key button disposed through the button accommodation recess, and including a key top inserted into the button accommodation recess and at least partially exposed to the outside, and a key base coupled to the key top, and including a protrusion facing a key flexible printed circuit board (FPCB) disposed in the inner space through the at least one through-hole. The protrusion may include an engagement portion formed at an end thereof to be larger than the protrusion.

The push switch 1 includes a case 2, a pair of contacts 3 and 4, a movable contact 5, a cap 7 covering the case 2 from the upper side, and a cover 8 pressing the cap 7 from the upper side. The cover 8 includes a top plate 81 and a pair of extending portions 83 extending downward from opposite sides of the top plate 81. Each of the extending portions 83 of the cover 8 has a pair of leg portions 831 extending downward and a bridge portion 832 connecting the pair of leg portions 831. The bridge portion 832 has a pair of inclined portions 8321 formed at the lower end portion of the bridge portion 832 and inclined outward, and a cutout portion 8322 formed between the pair of inclined portions 8321.

A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.

A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.