A hinge for component attachment is described. In at least some implementations, a kickstand is rotatably attached to a mobile computing device. The kickstand can be rotated to various positions to provide support for different orientations of the computing device. In at least some implementations, hinges are employed to attach a kickstand to a mobile computing device. One example hinge utilizes preset hinge stops that enable the kickstand to be placed at different preset positions. Another example hinge exerts pressure on an edge of the kickstand, providing stability and vibration dampening to the kickstand.

A hinge for component attachment is described. In at least some implementations, a kickstand is rotatably attached to a mobile computing device. The kickstand can be rotated to various positions to provide support for different orientations of the computing device. In at least some implementations, hinges are employed to attach a kickstand to a mobile computing device. One example hinge utilizes preset hinge stops that enable the kickstand to be placed at different preset positions. Another example hinge exerts pressure on an edge of the kickstand, providing stability and vibration dampening to the kickstand.

A switch is constituted by a movable conductive portion and a pair of fixed conductive portions. The fixed conductive portions are arranged on a substrate, and are each constituted by at least one strip member. A first main conductive pattern and a second main conductive pattern are arranged on the substrate in correspondence with the fixed conductive portions. The movable conductive portion electrically shorts the pair of fixed conductive portions upon coming into contact with both of them. The strip members that constitute the fixed conductive portions each have a first end portion and a second end portion in the extending direction, and the end portions are electrically connected to the corresponding main conductive patterns.

A mechanical key component and a mechanical keyboard are provided. The mechanical key component includes a circuit board, an elastic element and a key cap. The circuit board is provided with a first sensing electrode. The elastic element is disposed on the circuit board, and a movable portion of the elastic element is connected to a second sensing electrode. The key cap is movably disposed on the elastic element. The elastic element enables the key cap to move between an unpressed position and a pressed position, and the movable portion drives the second sensing electrode to move relative to the first sensing electrode. In response to the key cap being moved between the unpressed position and the pressed position, a coupling capacitance between the first sensing electrode and the second sensing electrode changes to indicate whether the key cap is in the unpressed position or the pressed position.

A mechanical key component and a mechanical keyboard are provided. The mechanical key component includes a circuit board, an elastic element and a key cap. The circuit board is provided with a first sensing electrode. The elastic element is disposed on the circuit board, and a movable portion of the elastic element is connected to a second sensing electrode. The key cap is movably disposed on the elastic element. The elastic element enables the key cap to move between an unpressed position and a pressed position, and the movable portion drives the second sensing electrode to move relative to the first sensing electrode. In response to the key cap being moved between the unpressed position and the pressed position, a coupling capacitance between the first sensing electrode and the second sensing electrode changes to indicate whether the key cap is in the unpressed position or the pressed position.

Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.