A processing system includes a master control module, an order module, a magnetic sensitive element sorting module, a pin processing module, a lead processing module, a pin lead welding module, a casing module and a glue injecting module, wherein the magnetic sensitive element sorting module is configured to grade and screen magnetic sensitive elements, the pin processing module is configured to process pins of magnetic sensitive elements, the lead processing module is configured to process wires into leads, the pin lead welding module is configured to weld leads on the pins of magnetic sensitive elements to form sensing elements, the casing module is configured to sleeve the sensing elements into the accommodating cavity of a shell, and the glue injecting module is configured to inject glue into the accommodating cavity of the shell to encapsulate the sensing elements and form magnetic switch sensors.

Magnetic coupling devices are disclosed which may be configured in at least three states. The various states may be provided through one or more of altering a position of a permanent magnet relative to another permanent magnet and altering a current level in a coil surrounding a permanent magnet.

Magnetic coupling devices are disclosed which may be configured in at least three states. The various states may be provided through one or more of altering a position of a permanent magnet relative to another permanent magnet and altering a current level in a coil surrounding a permanent magnet.