A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

A protection device comprises a first planar substrate, a second planar substrate, a heater and a fusible element. The first planar substrate comprises a first surface, and the second planar substrate comprises a second surface facing the first surface. The heater comprises a first heating element and a second heating element in parallel connection, and the first heating element is disposed on the first surface. The fusible element is disposed on the first surface and adjacent to the first and second heating elements, thereby the fusible element is melted by absorbing the heat generated by the first heating element and/or second heating element. The second heating element has a resistance at least twice that of the first heating element.

A method comprises: forming a first metallization layer on a semiconductor die, the first metallization layer including a metal fuse; and forming a second metallization layer on the first metallization layer, in which the second metallization layer includes a thermal conductor spaced from the metal fuse, and the first metallization layer is between the second metallization layer and the semiconductor die.

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

A protection element (10) of the present invention has a substrate (11), a first fuse element (12) and a second fuse element (13) connected in series on the substrate (11), a heater (14) connected between the first fuse element (12) and the second fuse element (13), a third upper electrode part (17) connected between the first fuse element (12) and the second fuse element (13) and connected to the heater (14) in series, a first conduction part (18) connected to the third upper electrode part (17) and having a lower resistance value than the heater (14), and a third lower electrode part (19) connected to the first conduction part (18) and configured to be connectable to an external protection circuit.

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

This protective element includes a fusible conductor (1a), three or more electrodes (2a), (2b), (2c) electrically connected to each other via the fusible conductor (1a), and a heating element configured to heat and fuse the fusible conductor (1a).

A protection element includes: a fuse element configured to be energized in a first direction, which is a direction from a first end portion of the fuse element to a second end portion of the fuse element; a shielding member including a plate-shaped part, configured to rotate around a rotation axis extending in a second direction orthogonal to the first direction, wherein the plate-shaped part viewed from the fuse element is divided to a first portion and a second portion at a contact position between the plate-shaped part and the rotation axis, and an area of the first portion and an area of the second portion are different from each other; and a case having therein a housing portion. Pressure elevation in the housing portion due to an arc discharge causes the shielding member to rotate around the rotation axis and the shielding member divides the housing portion.

The invention relates to a surge protection device, comprising at least one surge arrester and one thermally trippable switching device connected in series with the surge arrester, wherein the above-mentioned means form a structural unit and the thermal tripping means is arranged in the region in which heating of the surge arrester is to be expected on overloading thereof. The thermal tripping means is in the form of a stop part through which there is no operating or surge current flowing and which effects or enables unlatching of the switching device in the case of thermal overload. Furthermore, the stop part is coupled thermally and mechanically to a surface side of the surge arrester and blocks the movement path of a mechanically prestressed unlatching slide. In accordance with the invention, a contact platelet is inserted in the unlatching slide, said contact platelet producing an electrical connection between elements of the switching device and, with unlatching, the contact platelet is subjected to a shifting movement resulting in an interruption to the series circuit and movement of the unlatching slide into the space previously assumed by the contact platelet, wherein at least the section of that region of the unlatching slide which separates the elements of the switching device is insulating.

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.