Provided is a fuse device used for high rating and high current applications excellent in impact resistance at the time of current interruption, and capable of preventing falling off of the case. The fuse device includes: a base member; a cover member fitted to the base member and covering a surface of the base member; and a fuse element mounted on the surface of the base member; wherein one of the base member and the cover member is provided with a side wall intersecting with the plane of the surface of the base member and including an opening formed therein, and the other of the base member and the cover member is provided with a fitting projection projecting outward from a plane intersecting with the plane of the surface of the base member and fitted into the opening of the side wall.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.

A vertical surface mount device pass-through fuse including an electrically insulating fuse body, a fusible element disposed on a first side of the fuse body and extending between first and second terminals, an electrically insulating cap having a domed portion and a flanged portion extending from the domed portion, the domed portion disposed over the fusible element, and the flanged portion affixed to the fuse body, and a conductive lead frame having a bow portion and an elongate shank portion extending from the bow portion, wherein the bow portion is disposed on the cap and is connected to the first terminal, and wherein the shank portion extends away from the fuse body.

A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed on a bottom of the base, a fusible element electrically connected to the bus bar and disposed adjacent a rear of the rear wall, and a fuse terminal electrically connected to the fusible element and extending over a top of the rear wall, along a front of the rear wall, and onto a top of the base, the fuse module further including an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.

An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.

An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.

Provided is an electrical connection box according to which it is possible to easily handle a substrate and a fuse module. An electrical connection box for a vehicle includes: an insertion housing into which a plurality of fuses are to be inserted; a plurality of fuse terminals each having one end portion inserted into a surface of the insertion housing, the fuse terminals connecting the fuses to a substrate; and a holding member that is arranged opposing the one surface of the insertion housing and holds the fuse terminals. The holding member includes a gripping portion provided on a side opposite to the insertion housing, and the gripping portion has a finger placement portion used for gripping.

A semiconductor device is provided which includes an interlayer dielectric formed on a semiconductor substrate, a first insulating layer, having a trench, formed on the interlayer dielectric, a barrier film formed on side and bottom surfaces of the first trench, an electric fuse formed on the barrier film, a second insulating layer formed to directly contact the electric fuse, and a third insulating layer formed on the second insulating layer. A linear expansion coefficient of the electric fuse is greater than a linear expansion coefficient of the first insulating layer and the second insulating layer, and a melting point of the barrier film is greater than a melting point of the electric fuse.

A semiconductor device is provided which includes an interlayer dielectric formed on a semiconductor substrate, a first insulating layer, having a trench, formed on the interlayer dielectric, a barrier film formed on side and bottom surfaces of the first trench, an electric fuse formed on the barrier film, a second insulating layer formed to directly contact the electric fuse, and a third insulating layer formed on the second insulating layer. A linear expansion coefficient of the electric fuse is greater than a linear expansion coefficient of the first insulating layer and the second insulating layer, and a melting point of the barrier film is greater than a melting point of the electric fuse.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.