Patent classifications
H01H2201/036
PRESSURE MODULE
A pressure module comprises a substrate, a support structure and a pressing membrane. The support structure is connected to the substrate and the pressing membrane to form an accommodating cavity between the substrate and the pressing membrane. An electrode is disposed on a surface of the substrate or the pressing membrane and a variable resistance layer is respectively disposed on the opposite surface of the other of the substrate and the pressing membrane. On application of pressure to the pressing membrane, the pressing membrane is elastically deformed and the variable resistance layer is brought into contact with the electrode to form a contact area and a resistance value between the variable resistance layer and the electrode. The contact area and the elastic deformation is positively correlated.
HAPTIC KEYBOARD SYSTEM
One variation of a keyboard system includes: a substrate including an array of inductors; a tactile layer arranged over the substrate defining an array of key locations over the array of inductors; an array of magnetic elements, each arranged within the tactile layer at a key location configured to inductively couple to an adjacent inductor and configured to move relative to the adjacent inductor responsive to application of a force on the tactile layer at the key location; and a controller configured to read electrical values from the inductors. In response to detecting a change in electrical value at a first inductor, the controller also configured to: register a first keystroke of a first key type associated with a first key location defined over the first inductor; and drive an oscillating voltage across the first inductor to oscillate the tactile layer over the substrate during a haptic feedback cycle.
Pressure sensitive key normalization
Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.
Hinge for component attachment
A hinge for component attachment is described. In at least some implementations, a kickstand is rotatably attached to a mobile computing device. The kickstand can be rotated to various positions to provide support for different orientations of the computing device. In at least some implementations, hinges are employed to attach a kickstand to a mobile computing device. One example hinge utilizes preset hinge stops that enable the kickstand to be placed at different preset positions. Another example hinge exerts pressure on an edge of the kickstand, providing stability and vibration dampening to the kickstand.
DEVICE HAVING INTEGRATED INTERFACE SYSTEM
A portable computer includes a display portion comprising a display and a base portion pivotally coupled to the display portion. The base portion may include a bottom case and a top case, formed from a dielectric material, coupled to the bottom case. The top case may include a top member defining a top surface of the base portion and a sidewall integrally formed with the top member and defining a side surface of the base portion. The portable computer may also include a sensing system including a first sensing system configured to determine a location of a touch input applied to the top surface of the base portion and a second sensing system configured to determine a force of the touch input.
Pressure sensitive key normalization
Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.
SWITCH AND METHOD FOR MANUFACTURING THE SAME
Disclosed are a switch and a manufacturing method thereof. The switch comprises a base substrate; and an electrode disposed on a first surface or a second surface of the base substrate. The flexible electrode includes: a substrate in a range of about 5 to 70 vol %; conductive particles embedded in the substrate in a range of about 29.9 to 94.9 vol %; and a degradation inhibitor in a range of 0.1 to 1 vol %, based on a total of 100 vol % of the electrode. In particular, the substrate of the electrode is flexible and thus the electrode is flexible.
Input Device Securing Techniques
Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.
Pressure Sensitive Keys
Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.
Input device securing techniques
Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.