Patent classifications
H01H2205/026
Keyboard assemblies having reduced thicknesses and method of forming keyboard assemblies
Keyboard assemblies having reduced thicknesses and methods of forming the same. A keyboard assembly may include a printed circuit board (PCB) and a single membrane sheet adhered directly to the PCB. The single membrane sheet may substantially cover the PCB. The keyboard assembly may also include a group of dome switches coupled directly to the single membrane sheet. Another keyboard assembly may include a group of conductive pads and a group of membrane pads. Each of the group of membrane pads may be adhered directly to a corresponding one of the group of conductive pads. The keyboard assembly may also include a group of dome switches coupled directly to the membrane pads. Each of the group of dome switches may be coupled directly to a corresponding one of the group of membrane pads.
Computer thin film switch keyboard
The present invention discloses a computer thin film switch keyboard, wherein the keyboard comprises keys/keycaps, a light guide film, a fixing film/air hole layer, metal domes, an air slot layer, a conductive film/PCB and a key plate, the key plate is disposed at the lowest layer, the conductive film/PCB is disposed above the key plate, the air slot layer is disposed above the conductive film/PCB, the metal domes are disposed on the conductive film/PCB, more than one metal dome is disposed corresponding to key configurations on the keyboard, the fixing film/air hole layer is disposed above the metal domes, and the keys/keycaps are disposed above the fixing film/air hole layer. The present invention has characteristics of being light, thin, and easy to carry, and having a Bluetooth function, a short stroke, and lower noises, etc.
KEYBOARD DEVICE
A keyboard device includes plural keycaps and a membrane switch circuit member. The membrane switch circuit member is disposed under the plural keycaps. The membrane switch circuit member includes a wiring board and plural separate covering pads. The wiring board includes plural first trace patterns and plural second trace patterns corresponding to the plural keycaps. The plural second trace patterns are disposed on the wiring board and separated from the plural first trace patterns. There is a gap between each first trace pattern and the adjacent second trace pattern. The covering pads are disposed over the wiring board. The plural covering pads are aligned with the corresponding keycaps and cover the corresponding gaps. The covering pad has a triggering trace pattern over the corresponding gap.