An ion beam etching method includes applying a positive voltage for extracting ions into a vacuum container to a first electrode, under a first condition where irradiation of a substrate with an ion beam is blocked off by a shutter, generating plasma in an internal space under the first condition, forming the ion beam by forming, under the first condition, a second condition where a positive voltage is applied to the first electrode and a negative voltage is applied to a second electrode, and moving the shutter and processing the substrate by irradiating the substrate with the ion beam.

One or more examples relate, generally, to an apparatus. The apparatus includes a charged particle source and a charged particle pointer. The charged particle pointer urges charged particles emitted by the charged particle source in a predetermined direction. The charged particle pointer comprises a repeller, and an isolator positioned along a path extending from the repeller in the predetermined direction.

By irradiating a sample with an unfocused ion beam, processing accuracy of an ion milling device for processing a sample or reproducibility accuracy of a shape of a processed surface is improved. Therefore, the ion milling device includes a sample chamber, an ion source position adjustment mechanism provided at the sample chamber, an ion source attached to the sample chamber via the ion source position adjustment mechanism and configured to emit an ion beam, and a sample stage configured to rotate around a rotation center. When a direction in which the rotation center extends when an ion beam center of the ion beam matches the rotation center is set as a Z direction, and a plane perpendicular to the Z direction is set as an XY plane, the ion source position adjustment mechanism is capable of adjusting a position of the ion source on the XY plane and a position of the ion source in the Z direction.

A current quantity measuring method of multi-beams irradiates with a charged particle beam, amplifies an electric signal corresponding to multi-beams passed through a plurality of aperture holes of an aperture member having the plurality of aperture holes to form multi-beams by irradiation with the charged particle beam, receives the electric signal amplified in the minute current measurement unit and counting the number of electrons in the multi-beams, calculates a current quantity of the multi-beams passed through the plurality of aperture holes by using a product of the calculated number of electrons in the multi-beams and elementary charge, and corrects irradiation time of the charged particle beam of each of the plurality of aperture holes on the basis of the calculated current quantity.

To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method.

An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 μm to 350 μm. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.

An electron gun includes a cathode that is heated to emit thermions; a cathode heating power supply that supplies a cathode heating current for heating the cathode; a grid that has a first aperture formed therein and that has a grid voltage applied thereto, the grid voltage having a potential lower than that of the cathode, wherein the grid converges the thermions passing through the first aperture by the grid voltage; an anode that has a second aperture formed therein and that has an anode voltage applied thereto, wherein the anode causes the thermions extracted from the cathode to pass through the second aperture as an electron beam by the anode voltage; an anode-voltage power supply that applies the anode voltage to the anode; and a controller that causes the anode voltage having a positive potential to be applied from the anode-voltage power supply to the anode.

An ion beam profiling system include a beam profiling element, an ion sensitive element electrically isolated from the beam profiling element, an ion source configured to emit an ion beam at the beam profiling element and the ion sensitive element, and a current measuring device coupled to the ion sensitive element. The beam profiling element includes a plate of material have two parallel major surfaces, a first slit aperture extending through the plate of material and having a first longitudinal length extending in a direction parallel to the two parallel major surfaces, and a second slit aperture extending through the plate of material and having a second longitudinal length extending in a direction parallel to the two parallel major surfaces, wherein the first longitudinal length of the first slit aperture is perpendicular to the second longitudinal length of the second slit aperture.

The present disclosure provides a method to adjust asymmetric velocity of a scan in a scanning ion beam deposition or etch process to correct asymmetry of depositing or etching between the inboard side and the outboard side of device structures on a wafer, while maintaining the overall uniformity of the respective deposition or etch across the full wafer.

A method for controlling operation of an electron emission source includes acquiring, while varying an emission current of an electron beam, a characteristic between a surface current of a target object at a position on the surface of the target object irradiated with the electron beam, and the emission current, calculating, based on the characteristic, first gradient values each obtained by dividing the surface current of the target object by the emission current, in a predetermined range of the emission current in the characteristic, calculating a second gradient value by dividing a surface current of the target object by an emission current in a state where the electron beam has been adjusted, and adjusting a cathode temperature to make the second gradient value in the state where the electron beam has been adjusted be in the range of the first gradient values in the predetermined range of the emission current.

A device may include an electron source, a detector, and a deflector. The electron source may be directed toward a sample area. The detector may receive an electron signal or an electron-induced signal. A deflector may be positioned between the electron source and the sample. The deflector may modulate an intensity of the electron source directed to the sample area according to an electron dose waveform having a continuously variable temporal profile.