An electron microscope system and a method of measuring an aberration of the electron microscope system are disclosed. An aperture filters an electron beam at a diffraction plane of the electron microscope to pass through electrons having a selected energy and momentum. A displacement of an image of the passed electrons is measured at a detector in an image plane of the electron microscope. An aberration coefficient of the electron microscope is determined from the measured displacement and at least one of the energy and momentum of the passed electrons. The measured aberration can be used to alter a parameter of the electron microscope or an optical element of the electron microscope to thereby control the overall aberration of the electron microscope.

A particle beam system includes a particle source to produce a first beam of charged particles. The particle beam system also includes a multiple beam producer to produce a plurality of partial beams from a first incident beam of charged particles. The partial beams are spaced apart spatially in a direction perpendicular to a propagation direction of the partial beams. The plurality of partial beams includes at least a first partial beam and a second partial beam. The particle beam system further includes an objective to focus incident partial beams in a first plane so that a first region, on which the first partial beam is incident in the first plane, is separated from a second region, on which a second partial beam is incident. The particle beam system also a detector system including a plurality of detection regions and a projective system.

One embodiment relates to a method of automated inspection of scattered hot spot areas on a manufactured substrate using an electron beam apparatus. A stage holding the substrate is moved along a swath path so as to move a field of view of the electron beam apparatus such that the moving field of view covers a target area on the substrate. Off-axis imaging of the hot spot areas within the moving field of view is performed. A number of hot spot areas within the moving field of view may be determined, and the speed of the stage movement may be adjusted based on the number of hot spot areas within the moving field of view. Another embodiment relates to an electron beam apparatus for inspecting scattered areas on a manufactured substrate. Other embodiments, aspects and features are also disclosed.

An electron reflectometer includes: a sample stage; a source that produces source electrons; a source collimator; and an electron detector that receives collimated reflected electrons.

A composite beam apparatus includes an electron beam column for irradiating an electron beam onto a sample, a focused ion beam column for irradiating a focused ion beam onto the sample to form a cross section, and a neutral particle beam column having an acceleration voltage set lower than that of the focused ion beam column for irradiating a neutral particle beam onto the sample to perform finish processing of the cross section. The electron beam column, the focused ion beam column, and the neutral particle beam column are arranged such that the beams of the columns cross each other at an irradiation point. A controller controls the electron beam column to irradiate and scan the electron beam on the sample during cross section processing by the focused ion beam column and during finish processing by the neutral particle beam column. The composite beam apparatus is capable of suppressing the influence of charge build-up, or electric field or magnetic field leakage from an electron beam column, when subjecting a sample to cross-section processing with a focused ion beam and then performing finishing processing with another beam.

A system for inspecting and reviewing a sample, the system may include a chamber that is arranged to receive the sample and to maintain vacuum within the chamber during at least a scan period; an inspection unit; a review unit; and a mechanical stage for moving the sample, according to a scan pattern and during the scan period, in relation to the inspection unit and the review unit while a spatial relationship between the inspection unit and the review unit remains unchanged; wherein the inspection unit is arranged to detect, during the scan period, multiple suspected defects of the sample; and wherein the review unit is arranged to (a) receive, during the scan period, information about the multiple suspected defects; and (b) locate, during the scan period and in response to the information about the multiple suspected defects, at least one actual defect.

A particle beam system includes a particle source to produce a first beam of charged particles. The particle beam system also includes a multiple beam producer to produce a plurality of partial beams from a first incident beam of charged particles. The partial beams are spaced apart spatially in a direction perpendicular to a propagation direction of the partial beams. The plurality of partial beams includes at least a first partial beam and a second partial beam. The particle beam system further includes an objective to focus incident partial beams in a first plane so that a first region, on which the first partial beam is incident in the first plane, is separated from a second region, on which a second partial beam is incident. The particle beam system also a detector system including a plurality of detection regions and a projective system.

A secondary projection imaging system in a multi-beam apparatus is proposed, which makes the secondary electron detection with high collection efficiency and low cross-talk. The system employs one zoom lens, one projection lens and one anti-scanning deflection unit. The zoom lens and the projection lens respectively perform the zoom function and the anti-rotating function to remain the total imaging magnification and the total image rotation with respect to the landing energies and/or the currents of the plural primary beamlets. The anti-scanning deflection unit performs the anti-scanning function to eliminate the dynamic image displacement due to the deflection scanning of the plural primary beamlets.

An electron microscope system and a method of measuring an aberration of the electron microscope system are disclosed. An aperture filters an electron beam at a diffraction plane of the electron microscope to pass through electrons having a selected energy and momentum. A displacement of an image of the passed electrons is measured at a detector in an image plane of the electron microscope. An aberration coefficient of the electron microscope is determined from the measured displacement and at least one of the energy and momentum of the passed electrons. The measured aberration can be used to alter a parameter of the electron microscope or an optical element of the electron microscope to thereby control the overall aberration of the electron microscope.

A scanning electron microscope according to the present invention includes: an electron source that produces an electron beam; a trajectory dispersion unit that disperses the trajectory of an electron beam of electrons with a different energy value; a selection slit plate having a selection slit that selects the energy range of the dispersed electron beam; and a transmittance monitoring unit that monitors the transmittance of an electron beam, which is being transmitted through the selection slit. Accordingly, there can be provided a scanning electron microscope equipped with an energy filter that implements a stable reduction in energy distribution.